CHO-BOND® 700 Series Adhesives for Microelectronics Packaging; these pure silver-filled epoxy pastes are designed to meet the demanding requirements of semiconductor and microelectronic packaging. They are one-component systems with a unique combination of excellent die shear strength, low coefficients of thermal expansion, ionic purity, and high thermal and electrical conductivities. Each offers and extended working life with viscosity and thixotropy suitable for both time/pressure and positive displacement dispensing methods. CHO-BOND® SV712 die attach adhesive has been optimized for high-speed, automated dispensing. It exhibits no resin bleed out on a variety of substrates and metallizations. Information provided by Chomerics |