| TRA-BOND 2208 is a clear, almost water-white low viscosity epoxy adhesive system recommended for rigid laminating, filament winding, potting and bonding applications. This all-liquid formulation contains no solvents, and is easily mixed, handled and applied at room temperature as it has a very long useful pot-life, however a final elevated temperature bake is REQUIRED for complete cure. TRA-BOND 2208 develops rigid high-strength bonds with excellent mechanical, structural and electrical properties coupled with good color stability, moderate heat resistance and good shock resistance. It adheres to metals, glass, glass products and fabrics, ceramics, rigid plastics and other high-temperature resistant materials. Fully cured TRA-BOND 2208 has superior electrical properties, and it provides excellent resistance to water, weather, vapors, gases and petroleum fuels and lubricants, salt solutions, most mild acids and alkalis, and many other chemical compounds. An additional post-cure of 4 hours at 145°C is recommended when application temperatures higher than 145°C are anticipated. Information provided by Tra-Con Inc. |
