Arlon Electronic Materials 37N Polyimide Low-Flow

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Arlon Electronic Materials 37N Polyimide Low-Flow
Categories:	Polymer; Thermoset; Polyimide, TS
Material Notes:	37N is a polyimide low-flow prepreg suitable for bonding multilayer polyimide rigid-flex, attaching heat sinks to polyimide MLBs, or other applications where minimal and uniform resin flow is required. Tg > 200°C and expansion characteristics typical of polyimide greatly improves PTH reliability Good bond strength to Kapton® polyimide, copper and other metals Curable at temperatures as low as 350°F Excellent thermal stability Available in different flow ranges and fiberglass styles for optimal process flexibility Electrical and mechanical properties meeting the requirements of IPC-4101/42 Compatible with lead-free solder processing RoHS/WEEE compliant Typical Applications: Bonding multilayer polyimide rigid-flex Attaching heat sinks to polyimide MLBs Other applications where minimal and uniform resin flow is required Information provided by ARLON Electronic Materials.
Vendors:

Available Properties

Water Absorption, IPC TM-650 2.6.2.1
Tensile Strength, IPC TM-650 2.4.18.3
Flexural Strength, IPC TM-650 2.4.4
Poissons Ratio, ASTM D3039
Peel Strength, To Kapton, as received
Peel Strength, IPC TM-650 2.4.8.2, To Copper (1 oz./35 micron); At Elevated Temperatures
Peel Strength, IPC TM-650 2.4.8, To Copper (1 oz./35 micron); After Thermal Stress
Peel Strength, IPC TM-650 2.4.8, To Copper (1 oz./35 micron); After Process Solutions
Volume Resistivity, IPC TM-650 2.5.17.1, E24/125
Volume Resistivity, IPC TM-650 2.5.17.1, C96/35/90
Surface Resistance, IPC TM-650 2.5.17.1, C96/35/90
Surface Resistance, IPC TM-650 2.5.17.1, E24/125
Dielectric Constant, IPC TM-650 2.5.5.3, may vary with resin %
Dielectric Strength, IPC TM-650 2.5.6.2
Dissipation Factor, IPC TM-650 2.5.5.3
Arc Resistance, IPC TM-650 2.5.1
CTE, linear
CTE, linear, Transverse to Flow, IPC TM-650 2.4.24, z, below Tg
CTE, linear, Transverse to Flow, IPC TM-650 2.4.24, z, above Tg
Thermal Conductivity, ASTM E1461
Glass Transition Temp, Tg, IPC TM-650 2.4.24, TMA
Decomposition Temperature, IPC TM-650 2.3.41, Onset
Decomposition Temperature, IPC TM-650 2.3.41, 5 percent
Flammability, UL94

Property Data

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Category Notes
Plastic

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