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Solder Replacement
RoHS Compliant Adhesives for Solder Replacement
Master Bond offers RoHS compliant, electrically conductive systems to replace lead soldering. These epoxy and silicone adhesives offer low volume resistivity, low outgassing and high temperature resistance.
Lucas-Milhaupt FOS FLO 7 Copper Phosphorus Alloy (AWS BCuP-2)
Categories: Metal; Nonferrous Metal; Copper Alloy; Solder/Braze Alloy

Material Notes: Fos-Flo is a low cost brazing filler metal suitable for joining copper to copper and copper to copper alloys where critical impact or vibration stresses are not encountered in service. It should only be used on assemblies where good fit-up can be maintained. Fos-Flo is a copper rich, intermediate temperature, brazing filler metal that is free flowing. This alloy is extremely fluid when heated rapidly to its flow point and will penetrate joints with very little clearance. Best results are obtained with joint clearances of 0.001 in. - 0.003 in. (0.025 mm - 0.075 mm). Fos-Flo liquates (i.e. separates into high and low melting constituents) if heated slowly through its melting range. The self-fluxing property of Fos-Flo is effective on copper only. Copper base alloys, such as brass or bronze, may be brazed with Fos-Flo if the joints are coated with HandyFlux® . Fos-Flo should not be used on ferrous metals or nickel base alloys, since the phosphorus produces brittle iron or nickel phosphides at the joint interface. The corrosion resistance of Fos-Flo is comparable to that of copper except when exposed to sulfur compounds and sulfur-containing gas or oil, especially at elevated temperatures. Under these conditions Fos-Flo undergoes progressive corrosive deterioration, and should not be used.

Specifications:This filler metal conforms to the following specifications- AWS A5.8 BCuP-2, ASME Boiler & Pressure Vessel Code Sec. II-C, SFA5.8 BCuP-2

Information provided by Lucas-Milhaupt, Inc.

Vendors:
Available Properties
  • Density
  • Electrical Resistivity
  • Melting Point
  • Solidus, Melting Point
  • Liquidus, Flow Point
  • Processing Temperature, Brazing Range
  • Copper, Cu
  • Other, total
  • Phosphorus, P
  
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solder replacement adhesives
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