Cookson Group STAYCHIP® 3100 High Reliability Flip Chip Underfill

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Cookson Group STAYCHIP® 3100 High Reliability Flip Chip Underfill (discontinued **)
Categories:	Polymer; Adhesive; Thermoset; Epoxy
Material Notes:	STAYCHIP™ 3100 is an aromatic amine-cured epoxy underfill, designed for exceptional adhesion to common solder-mask and die passivation surfaces, even after exposure to elevated heat, pressure, and humidity. This material provides superior adhesion even after accelerated environmental conditioning. This fast flow underfill was formulated for penetration of gaps below 1mil. When fully cured, the material displays excellent reliability in thermal cycling performance. It is easily dispensed and also exhibits low moisture absorption for improved JEDEC performance. Features: Excellent Reliability in Thermal Cycling Excellent Reliability in JEDEC testing (Level 3/ 260°C on select laminate-based FCIP) Low Moisture Absorption Exceptional Adhesion (even after exposure to high humidity, pressure, and temperature) Fast, Efficient Flow Properties Self-filleting Capability Information provided by Cookson Electronics
Vendors:

Available Properties

Specific Gravity, ASTM D 792-00
Filler Content
Moisture Absorption at Equilibrium, ASTM D5229/D 5229M-92 (1998) e1. D 570-98, 24 hour boil
Particle Size
Brookfield Viscosity, ASTM D2196-99, Brookfield #51 at 10 RPM
Storage Temperature
Hardness, Shore D, ASTM D 2240-03
Fracture Toughness, ASTM D5045-99
Adhesive Bond Strength, DIN EN 60749-20, Shear strength to polyimide passivated Die, 75 micron gap, at 200°C
Adhesive Bond Strength, DIN EN 60749-19, Shear strength to polyimide passivated Die, 75 micron gap, at 25°C
Dielectric Constant
Dissipation Factor
Dissipation Factor
Dissipation Factor
CTE, linear, Alpha 1
CTE, linear, Alpha 2
Glass Transition Temp, Tg, ASTM D3418-99, By DSC
Flash Point, ASTM D 93-02
Pot Life, ISO 10364:1993, Time to double viscosity
Shelf Life

Property Data

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Manufacturer Notes:
none

Category Notes
Plastic

**
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