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Chemically Resistant adhesives
Parker Chomerics THERM-A-FORM 1642 Cure-in-Place Potting and Underfill Material
Categories: Polymer; Thermoset; Silicone

Material Notes: Description: THERM-A-FORMâ„¢ thermally conductive silicone elastomer products are dispensable form-in-place compounds designed for heat transfer without excessive compressive force in electronics cooling applications. These versatile liquid reactive materials can be dispensed and cured into complex geometries for cooling of multi-height components on a PCB without the expense of a molded sheet. Each compound is available in ready-to-use cartridge systems, eliminating weighing, mixing, and degassing procedures.

Product Attributes: General duty, economical thermal solution and two-component thermally conductive encapsulant/sealant/caulk/potting compound, supplied with primer 1087. (primer is not required for cure but promotes adhesion)

Information provided by Chomerics

Vendors:
Available Properties
  • Specific Gravity, ASTM D792
  • Viscosity, ASTM D2196
  • Outgassing - Total Mass Loss, ASTM D595, TML
  • Collected Volatile Condensable Material, ASTM D595
  • Hardness, Shore A, ASTM D2240
  • Volume Resistivity, ASTM D257
  • Dielectric Constant, ASTM D150
  • Dielectric Strength, ASTM D149
  • Dissipation Factor, Chomerics
  • CTE, linear, ASTM E831
  • Specific Heat Capacity, ASTM E1269
  • Thermal Conductivity, ASTM D5470
  • Maximum Service Temperature, Air
  • Minimum Service Temperature, Air
  • Brittleness Temperature, ASTM D2137
  • Cure Time
  • Cure Time
  • Cure Time
  • Pot Life, 2X Starting Viscosity
  • Shelf Life, From date of Manufacture
  
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Manufacturer Notes:
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Category Notes
Plastic

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Chemically Resistant adhesives
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