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Ensinger PEI
Kohesi Bond TUF 1820 ANHT One component, toughened, high strength epoxy for bonding and sealing
Categories: Polymer; Thermoset; Epoxy; Epoxy Adhesive; Epoxy, Thermally Conductive

Material Notes: Product Highlights:
  • Excellent thermal conductivity
  • Cryogenic service
  • Superb mechanical strength properties
  • Capable of passing NASA low outgassing
  • Low coefficient of thermal expansion (CTE)
  • Unlimited working life at room temperature
Kohesi Bond TUF 1820 ANHT is a toughened, single component epoxy system that offers high thermal conductivity while maintaining its superior electrical insulation properties. It requires no mixing and offers an unlimited working life at room temperature. It cures in merely 60 - 90 minutes at 120°C and even faster at higher temperatures. TUF 1820 ANHT offers an across-the-board service temperature range of 4K (-269.15°C) to +200°C. This product can withstand severe thermal cycling and shocks even at cryogenic temperatures. Being a one component system, it provides ease of application and also adheres well to a wide variety of substrates including metals, ceramics, composites, most plastics and glass. It provides phenomenal bonding and physical strength properties, extremely low coefficient of thermal expansion, outstanding dimensional stability and it is capable of passing NASA standards for low outgassing (ASTM E-595). TUF 1820 ANHT is a 100% solids and a reactive system i.e. it does not contain any solvents or diluents. It has a gray color and a smooth paste like consistency. It also extends first-rate chemical resistance to a variety of solvents, fuels and water. Owing to its performance and ease of use, TUF 1820 ANHT is widely used in sophisticated electronics, optoelectronic, aerospace and specialty OEM applications.

Typical Applications:

  • Bonding
  • Sealing

Information provided by Kohesi Bond Custom Engineered Adhesives

Vendors:
Available Properties
  • Hardness, Shore D
  • Tensile Strength
  • Tensile Modulus
  • Compressive Strength
  • Adhesive Bond Strength, Tensile Lap Shear, Al/Al
  • Peel Strength, Al/Al
  • Volume Resistivity
  • Dielectric Constant
  • Thermal Conductivity
  • Maximum Service Temperature, Air
  • Minimum Service Temperature, Air
  • Cure Time
  • Cure Time, Post cure
  • Shelf Life, in original unopened containers
  
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Manufacturer Notes:
none

Category Notes
Plastic

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