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Master Bond adhesives
Epoxy Technology EPO-TEK® T7139 Glob Top Epoxy
Categories: Polymer; Thermoset; Epoxy

Material Notes: Product Description: EPO-TEK® T7139 is a two component, electrically insulating, encapsulating epoxy designed for semiconductor glob top applications and package assembly.

Advantages & Application Notes:

  • A pot life of at least one day is mass production friendly and convenient for consecutive manufacturing shifts.
  • Its thixotropic nature allows for dispensing “domes or hemispheres” directly over the IC without the need for using a dam or cavity to control flow.
  • Suggested Applications:
    • Semiconductor:
      • Glob top encapsulant for COB die attach.
      • Plastic semiconductor package filling instead of traditional epoxy transfer molding compound.
    • Electronic/PCB: general protection of SMDs.
    • Opto-electronics: black and opaque epoxy for adhesive and sealing applications while blocking IR and VIS light.
  • In some cases, it is advantageous to pre-warm the epoxy < 50°C in order to decrease its thixotropic nature, while increasing capillary and flow rate.
  • Low CTE makes it ideal for keeping stresses to a minimum.

Information Provided by Epoxy Technology

Vendors:
Available Properties
  • Specific Gravity, Part A
  • Specific Gravity, Part B
  • Particle Size
  • Viscosity, 50 rpm
  • Hardness, Shore D
  • Tensile Modulus, Storage
  • Shear Strength, Lap
  • Shear Strength, Die
  • Volume Resistivity
  • Dielectric Constant
  • Dissipation Factor
  • CTE, linear, Below Tg
  • CTE, linear, Above Tg
  • Thermal Conductivity
  • Maximum Service Temperature, Air, Continuous
  • Maximum Service Temperature, Air, Intermittent
  • Minimum Service Temperature, Air, Continuous
  • Minimum Service Temperature, Air, Intermittent
  • Glass Transition Temp, Tg, Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min
  • Decomposition Temperature, Degradation Temperature
  • Transmission, Visible
  • Transmission, Visible
  • Transmission, Visible
  • Cure Time, Minimum Bond Line
  • Cure Time, Minimum Bond Line
  • Pot Life
  • Shelf Life
  
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Manufacturer Notes:
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Category Notes
Plastic

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