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Chemically Resistant adhesives
Epoxy Technology EPO-TEK® P1011 Electrically Conductive Modified Polyimide
Categories: Polymer; Adhesive; Thermoset; Polyimide, TS

Material Notes: Product Description: EPO-TEK® P-1011 is a single component, modified polyimide, silver-filled adhesive designed for chip bonding in microelectronic and optoelectronic applications.

Advantages & Application Notes:

  • Low stress die-attach adhesive that is very effective for bonding quartz crystal oscillators used in Rf / Microwave wireless devices.
  • Designed specifically for screen printing and machine dispensing applications. A lower viscosity version, called P1011S is available for die-stamping processes.
  • Recommended for screen printing applications; long dry time.
  • Good electrical and thermal conductivity.
  • Suggested for ceramic and DIP packaging of hybrids, as well as TO-Cans.

Information Provided by Epoxy Technology

Vendors:
Available Properties
  • Specific Gravity
  • Particle Size
  • Viscosity, 20 rpm
  • Ionic Impurities - Na (Sodium)
  • Ionic Impurities - K (Potassium)
  • Ionic Impurities - Cl (Chloride)
  • Hardness, Shore D
  • Shear Strength, Die
  • Volume Resistivity
  • CTE, linear, Below Tg
  • CTE, linear, Above Tg
  • Thermal Conductivity
  • Maximum Service Temperature, Air, Continuous
  • Maximum Service Temperature, Air, Intermittent
  • Minimum Service Temperature, Air, Continuous
  • Minimum Service Temperature, Air, Intermittent
  • Glass Transition Temp, Tg, Ramp 40°C/Min to 300°C
  • Decomposition Temperature, Degradation Temperature
  • Dry Time
  • Cure Time, Pre-Bake, Minimum Bond Line
  • Cure Time, Post-Cure, Minimum Bond Line
  • Shelf Life
  
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Manufacturer Notes:
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Category Notes
Plastic

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Chemically Resistant adhesives
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