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Chemically Resistant adhesives
Lord Adhesives Thermoset™ ME-542 Underfill Encapsulant
Categories: Polymer; Thermoset; Epoxy; Epoxy Encapsulant, Unreinforced

Material Notes: LORD Thermoset™ ME-542 encapsulant is an anhydridefree, thermally conductive, semiconductor grade epoxy underfill product developed for the encapsulation of densely populated area array flip chip devices. It is formulated with the necessary structural strength to handle over-molding processes.

Thermoset ME-542 encapsulant is engineered to withstand 260°C peak reflow temperatures of lead-free solders.

All information provided by Lord.

Vendors:
Available Properties
  • Specific Gravity
  • Water Absorption
  • Viscosity, TA Rheometer
  • Modulus of Elasticity, Storage
  • Shear Strength, Die
  • Volume Resistivity
  • CTE, linear, Alpha 1
  • CTE, linear, Alpha 2
  • Thermal Conductivity
  • Glass Transition Temp, Tg, TMA
  • Cure Time
  • Cure Time
  • Pot Life
  • Gel Time
  • Shelf Life
  • Potassium, K
  • Sodium, Na
  
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Plastic

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Chemically Resistant adhesives
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