| Product Description: EPO-TEK® H67MP is a single component, thermally conductive epoxy for military hybrid die and component attach. It can also be used for semiconductor and high temperature ceramic and vacuum packaging. Advantages & Application Notes: - A very high viscosity and thixotropic paste suitable for screen printing or manual hand operations.
- Performs exceptionally well as a die-attach for small chips such as GaAs, LEDs and diodes, as well as SMDs.
- Capable of resisting 260°C green reflow process, low outgassing in hermetic lid-seal processes near 300°C, and organic burn-in up to 150°C/1000 hours storage.
- Certified to MIL-STD 883/Test Method 5011 –yields low levels of water extractable ions such as chlorides.
- Capable of JEDEC Level II die-attach packaging on die-paddles and lead-frames.
- Widely used epoxy; popular choice for non-silver-filled die-attach epoxies; opto-packaging, hybrids, and many types of substrates including kovar, ceramic and BT.
- Available in different viscosity ranges
- Can be used as nonconductive staking epoxy, in conjunction with EPO-TEK® H37MP for attaching SMDs to hybrid circuits.
- A lower temp cure alternative to EPO-TEK®H65-175MP.
Information Provided by Epoxy Technology |
