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Chemically Resistant adhesives
Cookson Group Plaskon® ULS-12LA Molding Compound  (discontinued **)
Categories: Polymer; Thermoset; Epoxy; Epoxy Molding Compound

Material Notes: Test specimens were transfer molded and post cured 4 hours at 175°C.

An ultra low stress, low alpha emission molding compound designed for packaging stress-sensitive memory devices such as TSOPs and large QFPs. It offers an alpha particle count of <0.001 counts/cm2/hour and uranium/thorium levels of 0.5 to 0.8 ppb. Ultra low stress properties; Low moisture absorption; Outstanding moldability (good mold filling, low wire sweep, fast cycles and good hot hardness); Superior reliability

Vendors:
Available Properties
  • Density
  • Water Absorption
  • Viscosity, Automatic orifice Viscosity
  • Linear Mold Shrinkage
  • Spiral Flow
  • Hardness, Shore D
  • Flexural Strength
  • Flexural Modulus
  • Dielectric Constant
  • Dielectric Strength
  • Dissipation Factor
  • Arc Resistance
  • CTE, linear
  • CTE, linear, Transverse to Flow
  • Thermal Conductivity
  • Glass Transition Temp, Tg
  • Flammability, UL94
  • Flammability, UL94
  • Processing Temperature, Molding temperature
  
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Manufacturer Notes:
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Category Notes
Plastic

**
Materials flagged as discontinued () are no longer part of the manufacturer’s standard product line according to our latest information. These materials may be available by special order, in distribution inventory, or reinstated as an active product. Data sheets from materials that are no longer available remain in MatWeb to assist users in finding replacement materials.

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Chemically Resistant adhesives
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