Key Features:- Silver conductive
- Superior toughness
- High peel strength
- Withstands rigorous thermal cycling
- Cryogenically serviceable
- Exceptionally low volume resistivity
Product Description: Master Bond EP21TDCS is a two component, silver filled, electrically conductive adhesive for high performance bonding, sealing and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures. The optimum curing schedule being overnight at room temperature followed by a post cure of 1-2 hours at 150-200°F. This system features low linear shrinkage upon cure. Unlike many two part, silver conductive epoxy systems, EP21TDCS has a one to one mix ratio, by weight. EP21TDCS is an outstanding adhesive in both shear and peel modes. It is 100% reactive and does not contain any diluents or solvents; with very low shrinkage upon curing. Most striking is its superlative volume resistivity of less than 10-3 ohm-cm. EP21TDCS can be applied with minimal sagging or dripping on vertical surfaces; although, it can be made thinner (more flowable) by adding 5-10% of an appropriate solvent (xylene, acetone, etc.) by weight. EP21TDCS is also noteworthy for withstanding intense thermal cycling as well as shock and vibration. Due to the nature of its filler, EP21TDCS exhibits superb thermal conductivity. It bonds well to a wide variety of substrates, including composites, metals, glass, ceramics, vulcanized rubbers and many plastics. It has good chemical resistance to water, oils and fuels. It is serviceable over the exceptionally wide temperature range of 4K to +275°F enabling it to operate even in cryogenic applications. Parts A and B are both colored silver-gray. Master Bond EP21TDCS adhesive is widely used in the electronic, electrical, computer, semiconductor, microwave, aerospace and electrooptic industries, among others. For convenient handling, EP21TDCS is available in premixed and frozen syringes.Product Advantages: - Convenient mixing: one to one ratio by weight
- Exceedingly low volume resistivity
- Easy application: contact pressure only required for cure; adhesive spreads evenly and smoothly
- Versatile cure schedules: ambient temperature cures or fast elevated temperature cures as required
- High bond strength to similar and dissimilar Substrates
- Capable of withstanding severe thermal cycling
- Cryogenically serviceable
Information provided by Master Bond Inc. |
