Arlon Electronic Materials EP2 Enhanced Polyimide Laminate and Prepreg

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Arlon Electronic Materials EP2 Enhanced Polyimide Laminate and Prepreg
Categories:	Polymer; Thermoset; Polyimide, TS
Material Notes:	High reliability and high temperature material EP2 Enhanced Polyimide is the next generation of polyimide and prepreg products, engineered for improved properties and processing and for applications requiring optimum thermal performance. EP2 is a filled product, yet with significantly improved copper adhesion compared to traditional polyimides. Reduced water absorption, higher thermal conductivity and reduced CTE are all achieved while maintaining the full 250°C Tg of polyimide for thermal stability through process and application. Reduced cure cycle compared to traditional polyimides offers reduced process times throughout. Lower electrical loss results in improved signal integrity Toughened, non-MDA chemistry resists drill fracturing Fully compatible with lead-free solder processing Typical Applications: PCBs that are subjected to high temperatures during processing and rework, such as lead-free soldering. Reduced risk of latent PTH damage due to low Z-direction CTE Applications with significant service life expectations at high temperatures, such as aircraft engine instrumentation, on-engine applications, down-hole drilling and industrial sensor packages, under-hood automotive controls and burn-in testing of ICs (Burn-in-Boards) Information provided by ARLON Electronic Materials.
Vendors:

Available Properties

Density, ASTM D792 Method A
Water Absorption, IPC TM-650 2.6.2.1
Tensile Strength, IPC TM-650 2.4.18.3
Modulus of Elasticity, IPC TM-650 2.4.18.3
Flexural Strength, IPC TM-650 2.4.4, crosswise
Flexural Strength, IPC TM-650 2.4.4, lengthwise
Poissons Ratio, ASTM D3039, y
Poissons Ratio, ASTM D3039, x
Peel Strength, IPC TM-650 2.4.8.2, To Copper (1 oz./35 micron); At Elevated Temperatures
Peel Strength, IPC TM-650 2.4.8, To Copper (1 oz./35 micron); After Process Solutions
Peel Strength, IPC TM-650 2.4.8, To Copper (1 oz./35 micron); After Thermal Stress
Volume Resistivity, IPC TM-650 2.5.17.1, C96/35/90
Volume Resistivity, IPC TM-650 2.5.17.1, E24/125
Surface Resistance, IPC TM-650 2.5.17.1, C96/35/90
Surface Resistance, IPC TM-650 2.5.17.1, E24/125
Dielectric Constant, IPC TM-650 2.5.5.3, May vary with resin %
Dielectric Strength, IPC TM-650 2.5.6.2
Dielectric Breakdown, IPC TM-650 2.5.6
Dissipation Factor, IPC TM-650 2.5.5.3
Arc Resistance, IPC TM-650 2.5.1
CTE, linear, IPC TM-650 2.4.41, x ,y direction
CTE, linear, Transverse to Flow, IPC TM-650 2.4.24, z (< Tg)
CTE, linear, Transverse to Flow, IPC TM-650 2.4.24, z (> Tg)
Thermal Conductivity, ASTM E1461
Glass Transition Temp, Tg, IPC TM-650 2.4.24, TMA
Decomposition Temperature, IPC TM-650 2.3.41, Onset
Decomposition Temperature, IPC TM-650 2.3.41, 5 percent
Flammability, UL94

Property Data

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Plastic

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