Description: UPILEX, the ultra-high heat-resistant polyimide film, is the product of the polycondensation reaction between biphenyltetracarboxylic dianhydride (BPDA), of which process Ube Industries originally developed, and diamine. Most notable of these characteristics is UPILEX's physical, mechanical, electrical, and chemical properties under high-temperature conditions. UPILEX VT is a heat bonding type of polyimide film without using adhesive and applicable with various substrate material. Features: - Heat bonding ability with ceramics, silicon wafers, and metals
- Bonding temperature : 300°C
- Excellent characteristics as polyimide film
Applications: - FPC
- HDD Suspension
- Ceramics Lamination
- Metal substrate PCB
- Sheet heater
- Micro Machine
Information provided by UBE. |