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LECO for Empowering Results
Solvay CORFIL® 625-1 Potting Compound
Categories: Polymer; Thermoset; Polyimide, TS

Material Notes: Description: CORFIL® 625-1 potting compound is a one-part, low density material formulated for use in insert and edge filling of honeycomb core. It may also be used as a syntactic core splice adhesive. It is formulated to have low viscosity making it especially suitable for use with automated equipment. CORFIL 625-1 can be cured at either 250°F (121°C) or 350°F (177°C) with minimal to no exotherm in large applications.

Features & Benefits:

  • One-part pumpable material
  • 250°F (121°C)/ 350°F (177°C) cure
  • Minimal exotherm
  • -67 to 350°F (-55 to 177°C) service range

Information provided by Cytec, subsequently acquired by Solvay.

Available Properties
  • Density, Cured
  • Density, Cured at 121°C
  • Density, Cured at 177°C
  • Storage Temperature
  • Compressive Strength, Cured at 121°C
  • Compressive Strength, Cured at 177°C
  • Shear Strength, Tube, Cured at 121°C
  • Shear Strength, Tube, Cured at 177°C
  • Shear Strength, Tube, Cured at 121°C
  • Shear Strength, Tube, Cured at 177°C
  • Shear Strength, Tube, Cured at 121°C
  • Shear Strength, Tube, Cured at 177°C
  • Maximum Service Temperature, Air
  • Minimum Service Temperature, Air
  • Shelf Life
Property Data

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Manufacturer Notes:
Solvay, former Rhodia Engineering Plastics

Category Notes

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