Product Highlights:- Low ionic content
- Outstanding thermal conductivity
- Resists thermal shock and cycling
- Fast curing
- Excellent dimensional stability
- Unlimited working life at room temperature
Kohesi Bond TUF 1613 HT-GT is a single component, toughened epoxy system that requires no mixing and cures rapidly at elevated temperatures. Although it requires a minimum temperature of 120°C for curing (at which it cures extraordinarily fast), it can achieve even faster cures at elevated temperatures. TUF 1613 HT-GT offers an extensive service temperature range of -70°C to +200°C. Being a one component system, it provides ease of application and also adheres well to a broad variety of substrates including metals, ceramics, most plastics and glass. It provides outstanding bonding and physical strength properties, as well as dimensional stability. This product has the ability to withstand arduous thermal cycling and shock. TUF 1613 HT-GT is a 100% solids and a reactive system i.e. it does not contain any solvents or diluents. It offers minimum shrinkage upon cure and can be cast up to 1/8 inch thicknesses. In addition to superior electrical insulation, TUF 1613 HT-GT also offers phenomenal thermal conductivity (1.8 - 2 W/m/K). It has a tan - yellow color. With a unique combination of Excellent performance, this multi-functional epoxy system is universally used as a glob top or die attach and also as an adhesive in various electronics and electrical applications. Typical Applications: - Glob Top
- Coating
- Sealing
- Potting
- Encapsulation
Information provided by Kohesi Bond Custom Engineered Adhesives |
