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Master Bond adhesives
Parker Chomerics CHO-BOND® 1029 Conductive Adhesive
Categories: Polymer; Adhesive; Thermoset; Silicone

Material Notes: CHO-BOND® 1029 is a highly conductive silicone adhesive, intended for bonding Chomerics’ conductive silicone EMI gaskets to electrically conductive substrates. It is a two-component, siliver-plated-copper filled system which cures to a flexible, permanent bond. Unlike 1-part conductive silicone RTV adhesives, its cure can be accelerated with heat. CHO-BOND® 1029 should not be used as an EMI caulk. The material is highly conductive through a bond line of less than 8 mils, but through a bond line of greater thickness, CHO-BOND 1029 electrical conductivity sharply decreases.

Information provided by Chomerics

Vendors:
Available Properties
  • Specific Gravity
  • Thickness
  • Shear Strength, Lap
  • Volume Resistivity, DC resistance in ohms through a 2.58 cm2 by 0.02 cm thick sample
  • Maximum Service Temperature, Air
  • Minimum Service Temperature, Air
  • Cure Time
  • Cure Time
  • Shelf Life
  
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Manufacturer Notes:
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Category Notes
Plastic

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