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Master Bond adhesives

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ITW Devcon® DEVWELD 530 Methacrylate Adhesive
Categories: Polymer; Adhesive; Thermoset; Methacrylate; Methacrylate Adhesive

Material Notes: Devweld 530 is a two-part 1:1 methacrylate adhesive designed for structural bonding of thermoplastic, metal and composite assemblies. Devweld 530 offers a combination of high strength and stiffness as well as the ability to bond a wide range of materials.

FEATURES: • Room temperature cure• Non-sagging • Will fill gaps of up to 4mm • Excellent load bearing qualities • Resistant to weathering and humidity • Excellent shear, peel and impact strength • No surface preparation • 100% reactive.

Information provided by ITW Performance Polymers.

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
Density 0.960 g/ccPart B. Uncured
 0.980 g/ccMixed. Uncured
 1.01 g/ccPart A
Viscosity 40000 - 60000 cPPart A
 40000 - 60000 cPPart B
 
Mechanical PropertiesOriginal ValueComments
Tensile Strength 2900 - 3480 psi
Elongation at Break 15 - 25 %
Tensile Modulus 135000 - 165000 psicured
Adhesive Bond Strength 20.0 - 24.0 MPaLap Shear; [GBS] cured
 
Thermal PropertiesOriginal ValueComments
Maximum Service Temperature, Air 120 °C
Minimum Service Temperature, Air -55.0 °C
Flash Point 9.00 °FUncured
 
Processing PropertiesOriginal ValueComments
Cure Time 24.0 hourFull
Pot Life 4.00 - 6.00 min
 
Descriptive Properties
Chemical/Solvent ResistanceAcids and bases: excellent
 Hydrocarbons: excellent
 salt solution: excellent
ColorOff whitePart A
 yellowPart B
Fixture Time (mins)12 to 15Uncured
Gap Filling (in)0.0394 to 0.157
Mix Ratio by volume1:1Part A:Part B
Mix Ratio by weight1:1Part A:Part B

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PITWD9221 / 239730

Rulon Bearings

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