Henkel Loctite® ECCOBOND UF 3811 Epoxy

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Henkel Loctite® ECCOBOND UF 3811 Epoxy
Categories:	Polymer; Thermoset; Epoxy
Material Notes:	Appearance: Black liquid Cure: Heat cure Product Benefits: One component Room temperature flow capability Halogen free Reworkable Good thermal cycling reliability Stable electrical performance under standard Surface Insulation Resistance (SIR) Application: Underfill, Encapsulation Typical Package Application: Chip scale packages and BGA Typical Application: Flex applications LOCTITE ECCOBOND UF 3811 reworkable epoxy underfill is designed for CSP and BGA applications. This low viscosity material is formulated to flow at room temperature with no additional preheating required. It cures quickly at moderate temperatures to minimize stress to other components. When cured, this material has a high glass transition temperature while maintaining flexibility in order to protect solder joints during thermal cycling and drop testing. Information provided by Loctite®
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Physical Properties	Original Value	Comments

Viscosity	354 cP	CP50-1, Speed 20 rpm
Outgassing - Total Mass Loss	0.31 %	WVR, NASA Outgassing
	0.45 %	TML, NASA Outgassing
Collected Volatile Condensable Material	0.040 %	NASA Outgassing

Mechanical Properties	Original Value	Comments
Flexural Modulus	2445 MPa	Storage, DMA, 3-point bending

Electrical Properties	Original Value	Comments
Surface Resistance	1.00e+10 ohm	Insulation, after 168 hours 60ºC/90% RH

Thermal Properties	Original Value	Comments
CTE, linear	61.0 µm/m-°C	Cured, Below Tg
	190 µm/m-°C	Cured, Above Tg
Thermal Conductivity	0.230 W/m-K
Glass Transition Temp, Tg	124 °C	Cured, by TMA

Processing Properties	Original Value	Comments
Cure Time	7.00 min @Temperature 150 °C
	10.0 min @Temperature 130 °C
	30.0 min @Temperature 110 °C
	60.0 min @Temperature 100 °C
Shelf Life	12.0 Month @Temperature -20.0 °C

Descriptive Properties
Pot Life	3 days

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PLOCT5094 / 255305

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