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Metal adhesives

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Master Bond EP5TC-80 One component thermally conductive, electrically insulating epoxy
Categories: Polymer; Thermoset; Epoxy; Epoxy, Thermally Conductive

Material Notes: Key Features:
  • Paste consistency
  • Ultra fine particle size filler
  • Superior thermal conductivity
  • Low thermal resistance
Product Description: Master Bond EP5TC-80 is a one component, flowable paste epoxy for bonding, sealing and small encapsulation applications. EP5TC-80 is a special system. A typical, unfilled epoxy is highly electrically and thermally insulative (with a thermal conductivity value of about 0.25 W/(m-K)). Adding filler materials that conduct heat and not electricity, generally increases thermal conductivity (maybe up to 1-2 W/(m-K)). EP5TC-80 is able to achieve up to 3.3-3.7 W/ (m-K). It is shipped at -40°C and should be stored at that temperature. Once removed from the freezer, to obtain the best properties, the material should be used within 12 hours. Any leftover material should be discarded. This system bonds well to a wide variety of substrates such as metals, composites, ceramics and many plastics. It has particularly noteworthy tensile modulus and compressive strength. The filler material has ultra fine particles, with the largest being 10-15 microns, which allows it to be applied in very thin sections. The end result is very low thermal resistance. The combination of fine bond lines and thermal conductivity lowers the thermal resistance to 6-10 x 10-6 K-m2/W. Curing is simple and straightforward, 80°C for 90-120 minutes with an optional post cure of 1-2 hours at 80°C to optimize properties. EP5TC-80 resists water, oils and fuels. It is gray in color. The service temperature range is -50°C to +150°C. With its robust thermal conductivity, it can solve thermal management issues in aerospace, electronic, opto-electronic, and specialty OEM applications. EP5TC-80 is a versatile system which can be used for bonding heat sinks to circuit boards, coils and motors, die attaching in optics, bonding SMDs, potting power modules and encapsulation of very small coils.

Product Advantages:

  • Single component, no mixing needed
  • Flowable, can cure up to 1/4 inch thick
  • Low shrinkage
  • Highly dimensionally stable
  • Passes NASA low outgassing
Best usage within 12 hours after removing from freezer; discard leftover material

Information provided by Master Bond.

Vendors: Master Bond is a leading manufacturer of adhesives, sealants, coatings and potting compounds. Master Bond’s vast product line consists of over 3,000 epoxy, polyurethane, silicone, cyanoacrylate and latex adhesives that vary in viscosity, cure speed, strength, chemical resistance, electrical properties, etc. Our custom adhesives offer design flexibility and provide excellent bonding performance. Visit www.masterbond.com.

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Physical PropertiesOriginal ValueComments
Specific Gravity 2.45 g/cc
Solids Content 100 %
Viscosity 60000 - 180000 cPthixotropic
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore D 90 - 100
Tensile Strength 1500 - 3000 psi
Elongation at Break 0.50 - 1.5 %
Tensile Modulus >= 1.50e+6 psi
Compressive Strength 25000 - 27000 psi
Adhesive Bond Strength 250 - 450 psiTensile lap shear, Al to Al
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity >= 1.00e+14 ohm-cm
Dielectric Constant 4.6
@Frequency 60 Hz
 
Thermal PropertiesOriginal ValueComments
Thermal Conductivity 23.0 - 26.0 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 150 °C
Minimum Service Temperature, Air -50.0 °C
Glass Transition Temp, Tg 110 - 115 °C
 
Processing PropertiesOriginal ValueComments
Cure Time 90.0 - 120 min
@Temperature 80.0 °C
with optional post cure of 1-2 hours at 80°C
Shelf Life 3.00 - 6.00 Month
@Temperature -40.0 °C
storage in a freezer
 
Descriptive Properties
Thixotropic index2.7

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PMASTM5908 / 306797

Metal adhesives

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