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Ensinger PEI

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Master Bond UV22DC80ND One component, nanosilica filled, dual cure system with UV and heat curing mechanisms
Categories: Polymer; Thermoset; Epoxy; Epoxy Adhesive

Material Notes: Key Features:
  • Thixotropic paste
  • Minimal shrinkage upon curing
  • Low coefficient of expansion
  • Cures in shadowed out areas at 80°C
Master Bond UV22DC80ND is a nanosilica filled, UV dual cure system. The secondary cure is accomplished by adding heat, with the minimum temperature being 80°C. Essentially, this epoxy based system will cure readily upon exposure to UV light and if there are any shadowed out areas, heating at 80°C will complete the cure. The 80°C curing feature is particularly useful given the sensitivity of many plastics to elevated temperatures. The consistency of UV22DC80ND can best be described as a thixotropic paste. It dispenses readily, but has limited flow. This UV is a cationic type cure and is not oxygen inhibited. It bonds well to a wide variety of substrates including metals, glass, ceramics and most plastics. UV22DC80ND has very good chemical resistance to many acids, bases, fuels and solvents. It is a superb electrical insulator and it is also able to withstand rigorous thermal cycling. The service temperature range is -60°F to +350°F. As a nanosilica filled system, it has exceptionally low shrinkage upon curing and stellar dimensionally stability. Typically the UV portion occurs in 10-30 seconds at 365 nm with 10-40 milliwatts/cm2 of output. Areas not cured because of shadowing effects can be readily cured at 80°C for 30-60 minutes. Post curing at 125-150°C for 15-30 minutes will increase the Tg. Significantly, in addition to bonding, this UV can be used for small encapsulations as it will cure in thickness up to 0.09 inches. The combination of special flow properties and dual curing is especially intriguing. This epoxy is a viable option for high tech aerospace, electronics, optical and specialty OEM applications.

Product Advantages:

  • One component system; no mixing needed
  • Dual curing mechanism allows for curing in shadowed out areas and rapid fixturing time at 80°C
  • No oxygen inhibition
  • Very low shrinkage upon curing
  • Nano filled, high dimensional stability
  • NASA low outgassing

Information provided by Master Bond Inc.

Vendors: Master Bond is a leading manufacturer of adhesives, sealants, coatings and potting compounds. Master Bond’s vast product line consists of over 3,000 epoxy, polyurethane, silicone, cyanoacrylate and latex adhesives that vary in viscosity, cure speed, strength, chemical resistance, electrical properties, etc. Our custom adhesives offer design flexibility and provide excellent bonding performance. Visit www.masterbond.com.

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Physical PropertiesOriginal ValueComments
Solids Content 100 %
Water Absorption <= 1.0 %3 month immersion, 75°F
Linear Mold Shrinkage <= 0.010 in/in
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore D 75 - 85
Tensile Strength 6000 - 8000 psi
Tensile Modulus 400000 - 450000 psi
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity >= 1.00e+14 ohm-cm
Dielectric Constant 4.1
@Frequency 60 Hz
 
Thermal PropertiesOriginal ValueComments
CTE, linear 30.0 - 35.0 µm/m-°C
Maximum Service Temperature, Air 177 °C
Minimum Service Temperature, Air -51.0 °C
Glass Transition Temp, Tg 130 - 135 °C
 
Optical PropertiesOriginal ValueComments
Refractive Index 1.51
 
Processing PropertiesOriginal ValueComments
Shelf Life 6.00 Month
@Temperature 4.44 - 10.0 °C
 
Descriptive Properties
ViscosityThixotropic pasteuncured coating

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