Henkel Loctite® ABLESTIK 8322A Epoxy

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Henkel Loctite® ABLESTIK 8322A Epoxy
Categories:	Polymer; Thermoset; Epoxy
Material Notes:	Appearance: Silver Product Benefits: Snap curable Fast cure capability Minimal resin bleed Electrically conductive Low condensable volatiles Suitable for large device bonding Greater resistance to delamination Engineered for accurate bondline control Excellent dispensability, minimal tailing and stringing Cure: Heat cure Application: Die attach Filler Type: Silver LOCTITE ABLESTIK 8322A adhesive is designed for medium die attach applications. LOCTITE ABLESTIK 8322A die attach adhesive incorporates improvements in epoxy resin and adhesion technology to maintain significant bond strength after exposure to elevated temperatures and humidity. Information provided by Loctite®
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Physical Properties	Original Value	Comments

Moisture Absorption	0.750 %	Saturation, after 85% RH exposure
Brookfield Viscosity	9000 cP	Uncured, CP51, Speed 5 rpm

Mechanical Properties	Original Value	Comments
Tensile Modulus	11.0 MPa @Temperature 150 °C	Cured, DMTA
	11.0 MPa @Temperature 250 °C	Cured, DMTA
	1600 MPa @Temperature 25.0 °C	Cured, DMTA
	1800 MPa @Temperature -65.0 °C	Cured, DMTA
Shear Strength	13.8 MPa	Die, 2 X 2 mm Si die, Ag/Cu LF

Electrical Properties	Original Value	Comments
Volume Resistivity	2.4 ohm-cm

Thermal Properties	Original Value	Comments
CTE, linear	65.0 µm/m-°C	Cured, Below Tg
	135 µm/m-°C	Cured, Above Tg
Thermal Conductivity	0.700 W/m-K	Cured
Glass Transition Temp, Tg	30.0 °C	Cured, TMA

Processing Properties	Original Value	Comments
Cure Time	1.00 min @Temperature 175 °C	Snap Cure Schedule, Zone 1
	1.00 min @Temperature 160 °C	Snap Cure Schedule, Zone 2
	1.00 min @Temperature 160 °C	Snap Cure Schedule, Zone 3
	1.00 min @Temperature 160 °C	Snap Cure Schedule, Zone 4
	1.00 min @Temperature 175 °C	Snap Cure Schedule, Zone 5
	1.00 min @Temperature 190 °C	Snap Cure Schedule, Zone 6
	1.00 min @Temperature 250 °C	Snap Cure Schedule, Zone 7
	30.0 min @Temperature 175 °C	Alternate Cure Schedule
Working Life	24.0 hour
Shelf Life	12.0 Month @Temperature -40.0 °C	Uncured, from date of manufacture

Descriptive Properties
Bond Joint Resistance	<0.005 ohms/0.5 sq.in	Cu/Cu joint @ 5 x 5 mm, 25µm bondline
Extractable Ionic Content (ppm)	<10	Cured, Sodium (Na+)
	<20	Cured, Chloride (Cl-)
	<5	Cured, Potassium (K+)
Shear Strength	<0.1 kg-f	Die, 3 X 3 mm Si die, Snap Cured, Substrate: Pd/Ni/Cu LF @250°C
	0.3 kg-f	Die, 3 X 3 mm Si die,85ºC/85% RH exposure for 168 hours, Snap Cured, Substrate: Pd/Ni/Cu LF@200°C
	0.4 kg-f	Die, 3 X 3 mm Si die, Snap Cured, Substrate: Pd/Ni/Cu LF @200°C
	0.5 kg-f	Die, 3 X 3 mm Si die,85ºC/85% RH exposure for 168 hours, Snap Cured, Substrate: Ag/Cu LF @200°C
	0.6 kg-f	Die, 3 X 3 mm Si die,85ºC/85% RH exposure for 168 hours, Snap Cured, Substrate: Bare Cu LF@200°C
	0.6 kg-f	Die, 3 X 3 mm Si die, Snap Cured, Substrate: Bare Cu LF@250°C
	0.8 kg-f	Die, 3 X 3 mm Si die, Snap Cured, Substrate: Bare Cu LF @200°C
	0.8 kg-f	Die, 3 X 3 mm Si die, Snap Cured, Substrate: Ag/Cu LF@200°C
	0.8 kg-f	Die, 3 X 3 mm Si die, Snap Cured, Substrate: Ag/Cu LF@250°C
	1.5 kg-f	Die, 3 X 3 mm Si die, After 85ºC/85% RH exposure for 168 hours Oven Cured, Substrate: Ag/Cu LF@200°C
	1.7 kg-f	Die, 3 X 3 mm Si die, Oven Cured, Substrate: Ag/Cu LF@250°C
	1.9 kg-f	Die, 3 X 3 mm Si die, Oven Cured, Substrate: Ag/Cu LF@200°C
	11 kg-f	Die, 3 X 3 mm Si die, Snap Cured, Substrate: Ag/Cu LF@25°C
	12 kg-f	Die, Oven Cured
	13 kg-f	Die, 3 X 3 mm Si die, After 85ºC/85% RH exposure for 168 hours Oven Cured, Substrate: Ag/Cu LF@25°C
	22 kg-f	Die, 3 X 3 mm Si die, Oven Cured, Substrate: Ag/Cu LF@25°C
	5.9 kg-f	Die, 3 X 3 mm Si die,85ºC/85% RH exposure for 168 hours, Snap Cured, Substrate: Pd/Ni/Cu LF @25°C
	7.1 kg-f	Die, 3 X 3 mm Si die,85ºC/85% RH exposure for 168 hours, Snap Cured, Substrate: Bare Cu LF @25°C
	7.4 kg-f	Die, 3 X 3 mm Si die,85ºC/85% RH exposure for 168 hours, Snap Cured, Substrate: Ag/Cu LF @25°C
	9 kg-f	Die, 3 X 3 mm Si die, Snap Cured, Substrate: Pd/Ni/Cu LF @25°C
	9.3 kg-f	Die, Snap Cured
	9.4 kg-f	Die, 3 X 3 mm Si die, Snap Cured, Substrate: Bare Cu LF @25°C
Thixotropic Index	>4	Uncured, 0.5/5 rpm
Water Extract Conductivity	95 µmhos/cm	Cured
Weight Loss (%)	0.7	Cured, @ 300ºC
	0.8	10 x 10 mm Si die on glass slide

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PLOCT5029 / 255240

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