Rogers Corporation Ultralam® 3908 Liquid Crystalline Polymer Circuit Material

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Rogers Corporation Ultralam® 3908 Liquid Crystalline Polymer Circuit Material
Categories:	Polymer
Material Notes:	ULTRALAM® 3908 bondply is used as a bonding medium between copper and the dielectric material. This product was developed specifically for multi-layer substrate constructions. This adhesiveless film is well suited for high speed and high frequency applications in telecommunication network equipment, high-speed computer data links and other high performance applications. Features and Benefits: Excellent electrical properties - Stable dielectric constant for minimal cross talk between signal layers, allows use of thinner bonding film with very minimal signal loss Low modulus - Bends easily for flex applications, offers design flexibility and minimizes space requirements Extremely low moisture absorption - maintains stable electrical, mechanical and dimensional properties Flame resistant - halogen-free, UL94VTM/0 (meets requirements for consumer products) Typical Applications: All LCP flex interconnections - high speed switches and routers, Backplane-to-backplane, Data links, Card-to-card Hybrid substrates - Handheld and RF devices Information provided by Rogers Corporation.
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Physical Properties	Original Value	Comments

Water Absorption	0.040 % @Time 86400 sec	IPC 2.6.2
Thickness	1.00 - 2.00 mil	10% tolerance for variation

Mechanical Properties	Original Value	Comments
Tensile Strength	31000 psi	IPC 2.4.19
Tensile Modulus	355 ksi	IPC 2.4.19
Tear Strength Test	>= 1.4	kg; IPC 2.4.16

Electrical Properties	Original Value	Comments
Volume Resistivity	2.60e+20 ohm-cm	IPC 2.5.17.1
Surface Resistance	1.20e+18 ohm	IPC 2.5.17.1
Dielectric Constant	2.9 @Frequency 1e+10 Hz	IPC-TM-650 2.5.5.5.1
Dielectric Strength	3000 V/mil	ASTM D149
Dissipation Factor	0.0025 @Frequency 1e+10 Hz	IPC-TM-650 2.5.5.5.1

Thermal Properties	Original Value	Comments
CTE, linear	17.0 µm/m-°C @Temperature 30.0 - 150 °C	X-, Y-Direction; IPC 2.4.41.3
	150 µm/m-°C @Temperature 30.0 - 150 °C	Z-Direction; IPC 2.4.41.3
Melting Point	280 °C	DSC
Maximum Service Temperature, Air	>= 240 °C	UL RTI
UL RTI, Mechanical without Impact	190 °C
Flammability, UL94	V-0

Descriptive Properties
Chemical Resistance	98.7 percent	IPC 2.3.4.2
Coefficient of Hygroscopic Expansion	4 ppm/%RH	60°C
Dimensional Stability	< 0.1%	MD; IPC 2.2.4 method B
	< 0.1%	TD; IPC 2.2.4 method B
Solder Float	pass	IPC 2.4.13, Method B; 288°C

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