Polyimide film obtained from "UPIA®" exhibits a high thermal decomposition temperature. Especially, "UPIA®-ST (U-Varnish-S)" has a thermal decomposition temperature above 550°C, so it does not soften, fluidize, or decompose under use temperatures and it is able to be used in high-temperature processes. In addition, the polyimide coating has excellent dimensional stability even at high temperatures.Information provided by UBE Industries, LTD |