UBE Upilex® 50VT Polyimide Film

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UBE Upilex® 50VT Polyimide Film
Categories:	Polymer; Thermoset; Polyimide, TS; Polyimide, Thermoset Film
Material Notes:	UPILEX®-VT and UPILEX®-NVT are heat bonding polyimide films having heat fusing layers on both side of the film, created by the polyimide resin equivalent of UPILEX®-S. High quality flexible circuits without an adhesive layer are obtained, by heating and pressing UPILEX®-VT or UPILEX®-NVT with metal (Cu, SUS, Al) foil. In addition, they are also available for bonding films comprised of metal, ceramic and other materials. Flexible circuits without adhesive are produced. This offers high tensile strength and tear strength. Offering the same low water absorption, low dimensional change and high heat resistance as UPILEX®-S, with the addition of laminate workability in the heat press. Information provided by UBE Industries, LTD
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Physical Properties	Original Value	Comments

Density	1.44 g/cc	ASTM D1505-03
Water Absorption	1.4 %	ASTM D570

Mechanical Properties	Original Value	Comments
Tensile Strength	540 MPa	ASTM D882
Elongation at Break	90 %	ASTM D882
Tensile Modulus	7.60 GPa	ASTM D882
Tear Strength	4.30 kN/m	IPC-TM-650 2.4.17.1

Electrical Properties	Original Value	Comments
Volume Resistivity	>= 1.00e+14 ohm-cm	DC 100V; ASTM D257
Surface Resistance	>= 1.00e+15 ohm	DC 100V; ASTM D257
Dielectric Constant	3.3 @Frequency 1e+9 Hz	Triplate-Line Resonator
	3.3 @Frequency 1e+10 Hz	Triplate-Line Resonator
Dielectric Strength	10.5 kV/mm @Frequency 60 Hz	ASTM D149
Dissipation Factor	0.0040 @Frequency 1e+9 Hz	Triplate-Line Resonator
	0.0070 @Frequency 1e+10 Hz	Triplate-Line Resonator

Thermal Properties	Original Value	Comments
CTE, linear	20.0 µm/m-°C @Temperature 50.0 - 300 °C	Fine linear dilatometer
Decomposition Temperature	582 °C	TG-DTA. In air. @ 5% wieght loss
Flammability, UL94	V-0
Shrinkage	0.35 % @Temperature 300 °C, Time 7200 sec	heat; JIS C2318

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PUBD9852 / 287315

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