Superior Flux Superior No. 1261 Aluminum Tinning Flux

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RoHS Compliant Adhesives for Solder Replacement
Master Bond offers RoHS compliant, electrically conductive systems to replace lead soldering. These epoxy and silicone adhesives offer low volume resistivity, low outgassing and high temperature resistance.

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Superior Flux Superior No. 1261 Aluminum Tinning Flux
Categories:	Metal; Nonferrous Metal; Solder/Braze Alloy
Material Notes:	A high activity flux designed for low temperature soldering of Aluminum and Aluminum alloys. Liquid form ideal for tinning applications. Effective on joining Aluminum to most ferrous and non-ferrous alloys. Organic-based, chloride-free. Description: Superior 1261 is a high activity, organic-based, chloride-free, liquid Aluminum soldering flux. Applications in which this flux should be used include: Aluminum-to-Aluminum, Aluminum-to-Copper, Aluminum-to-Brass, and Aluminum-to-plated terminals. This flux also performs well in hot dip coating of Aluminum cable connectors to provide a low-electrical resistance contact surface. Superior 1261 can also be utilized in joining Aluminum to difficult-to-solder metals like stainless steel, kovar, or nickel. Works effectively with 91Sn/9Zn (Eutectic 199ºC/390ºF) and other tin/zinc plastic phase alloys.; also proven to work effectively with other tin-based solder alloys, such as SN100C and 99.3Sn/0.7Cu. Information provided by Superior Flux
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Physical Properties	Original Value	Comments

Specific Gravity	1.216 - 1.316 g/cc
Density	10.55 lb/gal
pH	9.0 - 10	10.6% Solution

Thermal Properties	Original Value	Comments
Flash Point	180 °C	TCC Method

Processing Properties	Original Value	Comments
Processing Temperature	177 - 288 °C	Soldering Range
Shelf Life	2.00 Month

Descriptive Properties
Appearance	Clear, amber viscous liquid
Form	Liquid

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NSFLUX091 / 185775

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