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Metal adhesives

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Henkel Loctite® ABLESTIK 2030SCM Adhesive
Categories: Polymer; Adhesive

Material Notes: Appearance: Silver

Product Benefits:

  • Snap curable
  • Low stress
Cure: Heat cure

Application: Die attach

LOCTITE ABLESTIK 2030SCM die attach adhesive has been formulated for use in high throughput die attach applications. This material is designed to minimize stress and resulting warpage between dissimilar surfaces. It can be used in a variety of package sizes.

Information provided by Loctite®

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
pH 4.5
Brookfield Viscosity 14000 cPUncured, CP51, Speed 5 rpm
 
Mechanical PropertiesOriginal ValueComments
Tensile Modulus 350 MPa
@Temperature 150 °C
Cured, DMTA
 450 MPa
@Temperature 250 °C
Cured, DMTA
 3300 MPa
@Temperature 25.0 °C
Cured, DMTA
 6200 MPa
@Temperature -65.0 °C
Cured, DMTA
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 0.00020 ohm-cmcured 90 seconds @ 110ºC
 
Thermal PropertiesOriginal ValueComments
Thermal Conductivity 2.30 W/m-KCured
 
Processing PropertiesOriginal ValueComments
Cure Time 0.167 min
@Temperature 150 °C
Alternate Cure Schedule
 1.50 min
@Temperature 110 °C
Shelf Life 12.0 Month
@Temperature -40.0 °C
Uncured, from date of manufacture
 
Descriptive Properties
Bond Joint Resistance0.008 ohmscured 90 seconds @ 110ºC, Cu/Cu, 25µm Bondline
Extractable Ionic Content (ppm)<20Cured, Chloride (Cl-)
 <30Cured, Sodium (Na+)
 <5Cured, Potassium (K+)
Shear Strength0.87 kg-fDie, 3 X 3 mm Si die, cured 90 seconds @ 110ºC, Substrate:PBGA-FR4 @ 200°C
 0.96 kg-fDie, 3 X 3 mm Si die, cured 90 seconds @ 110ºC, Substrate: PBGA-FR4 @ 150°C
 1.9 kg-fDie, 3 X 3 mm Si die, cured 90 seconds @ 110ºC, Substrate: PBGA-FR4 @ 25°C
 1.9 kg-fDie, 2 X 2 mm, Si die on Pd
 2.11 kg-fDie, 2 X 2 mm, Au die on Au
 2.24 kg-fDie, 2 X 2 mm, Au die on SS
Thixotropic Index4.6Uncured, 0.5/5 rpm
Weight Loss (%)0.4Cure, 10 x 10 mm Si die on glass slide
 0.41After Cure, 16 hours Isothermal @ 125ºC
 0.5After Cure, Ramp to 230ºC

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PLOCT5013 / 255224

Metal adhesives

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