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Ensinger PEI

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Evonik VESTAMID® L1723 blk Nylon 12  (discontinued **)
Categories: Polymer; Thermoplastic; Nylon (Polyamide PA); Nylon 12 (PA12)
Material Notes: Low-viscosity, plasticized PA12 resin for injection molding. VESTAMID® L1723 blk.

Application examples: strip clips, cable ties.

Property data for dry samples unless otherwise noted.

Information provided by Evonik.
Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
Density 1.03 g/ccISO 1183
 1.04 g/ccConditioned; ISO 1183
Moisture Absorption 0.500 %Sim. to ISO 62
Linear Mold Shrinkage, Flow 0.016 cm/cmISO 294-4, 2577
Linear Mold Shrinkage, Transverse 0.015 cm/cmISO 294-4, 2577
Melt Flow 41 g/10 min
@Load 2.16 kg,
Temperature 230 °C		ISO 1133
 160 g/10 min
@Load 5.00 kg,
Temperature 230 °C		ISO 1133
 
Mechanical PropertiesOriginal ValueComments
Tensile Strength at Break 48.0 MPaISO 527
Tensile Strength, Yield 28.0 MPaConditioned; ISO 527
 30.0 MPaISO 527
Elongation at Break >= 50 %Conditioned. Nominal; ISO 527
 >= 50 %Nominal; ISO 527
 330 %ISO 527
Elongation at Yield 26 %Conditioned; ISO 527
 27 %ISO 527
Tensile Modulus 450 MPaConditioned; ISO 527
 525 MPaISO 527
50% Modulus 0.0270 GPa
@Strain 50 %		ISO 527
Charpy Impact, Notched 5.00 kJ/m²
@Temperature -30.0 °C		Complete Break; ISO 179/1eA
 5.00 kJ/m²
@Temperature -30.0 °C		Complete Break, Conditioned; ISO 179/1eA
 15.0 kJ/m²
@Temperature 23.0 °C		Complete Break; ISO 179/1eA
 41.0 kJ/m²
@Temperature 23.0 °C		Complete Break; ISO 179/1eA
Tensile Creep Modulus, 1 hour 380 MPa
@Strain 0.5 %		ISO 899-1
Tensile Creep Modulus, 1000 hours 290 MPa
@Strain 0.5 %		ISO 899-1
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 4.00e+9 ohm-cmConditioned; IEC 62631-3-1
 1.00e+10 ohm-cmIEC 62631-3-1
Surface Resistance 2.00e+13 ohmIEC 62631-3-2
Dielectric Constant 3.7
@Frequency 1e+6 Hz		Sim. to IEC 60243-1
 4.7
@Frequency 1e+6 Hz		Conditioned; Sim. to IEC 60243-1
 10
@Frequency 100 Hz		Sim. to IEC 60243-1
 14
@Frequency 100 Hz		Conditioned; Sim. to IEC 60243-1
Dielectric Strength 31.0 kV/mmConditioned; AC, S20/S20; IEC 60243-1
 33.0 kV/mmAC, S20/P50; IEC 60243-1
Dissipation Factor 0.12
@Frequency 1e+6 Hz		IEC 62631-2-1
 0.14
@Frequency 100 Hz		Conditioned; IEC 62631-2-1
 0.16
@Frequency 100 Hz		IEC 62631-2-1
 0.17
@Frequency 1e+6 Hz		Conditioned; IEC 62631-2-1
Comparative Tracking Index 600 Vtest solution A, 100 drops value; IEC 60112
 600 VTest solution A, 50 drops value. Conditioned; IEC 60112
 600 Vtest solution A, 50 drops value; IEC 60112
 
Thermal PropertiesOriginal ValueComments
CTE, linear, Parallel to Flow 180 µm/m-°C
@Temperature 23.0 - 55.0 °C		ISO 11359-1/-2.
CTE, linear, Transverse to Flow 180 µm/m-°C
@Temperature 23.0 - 55.0 °C		ISO 11359-1/-2.
Melting Point 173 °CISO 11357-1/-3
Deflection Temperature at 0.46 MPa (66 psi) 95.0 °CISO 75-1/-2
Deflection Temperature at 1.8 MPa (264 psi) 45.0 °CISO 75-1/-2
Vicat Softening Point 130 °CMethod B: 10 N, 50 K/h; ISO 306
Flammability Test 1.0
@Thickness 3.20 mm		IEC 60695-11-10
 1.0
@Thickness 1.60 mm		IEC 60695-11-10
 
Processing PropertiesOriginal ValueComments
Melt Temperature 200 °CTest condition for mold shrinkage
Mold Temperature 80.0 °CTest condition for mold shrinkage

**
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PEVONIK846 / 243054

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