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Metal adhesives

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ASI® MP 54190 Epoxy Adhesive
Categories: Polymer; Thermoset; Epoxy; Epoxy Adhesive

Material Notes: MP 54190 is a two part mineral filled epoxy adhesive designed for bonding metals and plastics. It cures at room temperature to a tough, semi-flexible material. It has good wetting to most surfaces and is free flowing to penetrate cavities and give good self leveling and air release. This product gives very good vibration and impact resistance. It gives good resistance to water, salt spray, inorganic acids and bases and most organic solvents. It was formulated to a 1A:1B volume mix ratio for use in side-by-side dispensing cartridges and meter/mix and dispense equipment. MP 54190 will reach handle cure at room temperature within 16 – 24 hours. Cure time can be accelerated by the application of heat. Times and temperatures from 2 hours at 65°C to 20 minutes at 100°C are typical for most applications. Time to heat substrate must be taken into account. Cooler temperatures will also extend work time and increase cure times.

Information provided by Adhesive Systems, Inc.

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
Specific Gravity 1.31 g/cc
@Temperature 25.0 °C
part B
 1.32 g/cc
@Temperature 25.0 °C
mixed
 1.34 g/cc
@Temperature 25.0 °C
part A
Viscosity 80000 cP
@Temperature 25.0 °C
part A
 80000 cP
@Temperature 25.0 °C
part B
 80000 cP
@Temperature 25.0 °C
mixed
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore D 70
@Temperature 25.0 °C
Tensile Strength 1800 psi
@Temperature 25.0 °C
Elongation at Break <= 60 %
@Temperature 25.0 °C
Adhesive Bond Strength 3000 psiLap Shear; Al to Al
Peel Strength 25.0 pli
@Temperature 25.0 °C
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity >= 8.00e+13 ohm-cm
@Temperature 25.0 °C
Dielectric Constant 4.5
@Frequency 100 Hz,
Temperature 25.0 °C
Dielectric Strength 410 V/mil
@Temperature 25.0 °C
 
Thermal PropertiesOriginal ValueComments
Maximum Service Temperature, Air 150 °C
Minimum Service Temperature, Air -60.0 °C
 
Processing PropertiesOriginal ValueComments
Cure Time 2.00 hour
@Temperature 65.0 °C
alternate cure
 24.0 - 72.0 hour
@Temperature 25.0 °C
alternate cure
Pot Life >= 60.0 min
@Temperature 25.0 °C
100 grams
Shelf Life 12.0 Month
 
Descriptive Properties
Color / appearancetranslucent
Mix Ratio103 (part A) : 100 (part B) by weight or 1:1 by volume

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PASINC9089 / 233456

Metal adhesives

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