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Flame Retardant adhesives

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Momentive Performance Materials SnapSil® TN3085 Low Volatile Siloxane, Silicone Adhesive
Categories: Polymer; Adhesive; Thermoset; Silicone

Material Notes: SnapSil TN3085 is a one-component, thermally conductive, low volatile siloxane, silicone adhesive that cures at room temperature upon exposure to atmospheric moisture. It cures to form an elastic, flame retardant silicone rubber and exhibits Primerless adhesion to many substrates.

Features: Fast tack-free time, Low volatility, Non-corrosive to most metals, Primerless adhesion to many substrates, Low odor cure: releases an alcohol vapor during cure, Thermally conductive, Flame retardant (UL94 V-0, File No. E56745). Potential Applications: Bonding in power supplies, Thermal adhesive between electronic components and heat sinks, Securing PCBs to substrates.

Information provided by Momentive Performance Materials.

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
Density 1.63 g/ccCured
 
Chemical PropertiesOriginal ValueComments
Ionic Impurities - Na (Sodium) <= 2.0 ppmCured
Ionic Impurities - K (Potassium) <= 2.0 ppmCured
Ionic Impurities - Cl (Chloride) <= 2.0 ppmCured
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore A 46
Tensile Strength 2.30 MPa
Elongation at Break 150 %
Adhesive Bond Strength 1.30 MPa
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 4.00e+14 ohm-cmCured
Dielectric Constant 4.0
@Frequency 60 Hz
Cured
Dielectric Strength 23.0 kV/mmCured
Dissipation Factor 0.040
@Frequency 60 Hz
Cured
 
Thermal PropertiesOriginal ValueComments
Thermal Conductivity 0.700 W/m-KCured
Flammability, UL94 V-0
 
Processing PropertiesOriginal ValueComments
Processing Temperature 23.0 °C
@Time 259000 sec
Cure as Tested at 50% RH
Cure Time 12.0 hour
@Temperature 30.0 °C
2.5 mm cure depth. 60% RH
 12.0 hour
@Temperature 10.0 °C
1.0 mm cure depth. 30% RH
 12.0 hour
@Temperature 23.0 °C
1.9 mm cure depth. 50% RH
 48.0 hour
@Temperature 10.0 °C
1.5 mm cure depth. 30% RH
 48.0 hour
@Temperature 23.0 °C
4.0 mm cure depth. 50% RH
 48.0 hour
@Temperature 30.0 °C
4.7 mm cure depth. 60% RH
 72.0 hour
@Temperature 23.0 °C
5.0 mm cure depth. 50% RH
 72.0 hour
@Temperature 30.0 °C
5.8 mm cure depth. 60% RH
 72.0 hour
@Temperature 10.0 °C
2.0 mm cure depth. 30% RH
Tack-Free Time 7.00 min
 
Descriptive Properties
Adhesion PerformanceAdhesive failurePolyethylene
 Adhesive failurePolytetraflucroethylene
 Good (cohesive failure)ABS
 Good (cohesive failure)Acrylic Resin
 Good (cohesive failure)Aluminum
 Good (cohesive failure)Copper
 Good (cohesive failure)Epoxy Resin
 Good (cohesive failure)Glass
 Good (cohesive failure)Nylon
 Good (cohesive failure)PBT
 Good (cohesive failure)PET
 Good (cohesive failure)Phenolic Resin
 Good (cohesive failure)Polycarbonate
 Good (cohesive failure)PPO
 Good (cohesive failure)PPS
 Good (cohesive failure)PVC
 Good (cohesive failure)Steel
AppearanceNon-flowable paste.Uncured
 RubberCured
ColorGray, whiteCured
 Gray, whiteUncured
Volatile Siloxane (%wt)0.01Cured. (D4-D10)

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PMOMEN9904 / 265713

Flame Retardant adhesives

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