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Metal adhesives

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Master Bond EP30TC Two component, room temperature curing, thermally conductive epoxy
Categories: Polymer; Thermoset; Epoxy; Epoxy, Thermally Conductive

Material Notes:
  • Highly thermally conductive filler
  • Applicable in very thin bond lines
  • Superior electrical insulation properties
  • NASA low outgassing
Master Bond EP30TC is a multifaceted epoxy for use in thermal management applications. It is a specialty formulation that can be used for bonding, coating, sealing and encapsulation. When used as an adhesive, the thermally conductive filler has very fine particle sizes; subsequently, it can be applied in sections as thin as 5-15 microns. Since it has a lower viscosity and excellent flow properties, it is a good fit for coating and potting. EP30TC has a forgiving ten to one mix ratio by weight. It will cure in 2-3 days at room temperature or in 2-3 hours at 150-200°F. To optimize properties, the recommended cure schedule is overnight at room temperature followed by 2-3 hours at 150-200°F. EP30TC bonds well to a variety of substrates including metals, composites, ceramics, glass and many plastics. As mentioned previously, it has a specialty type filler that allows it to be applied in very thin sections. When this property is combined with its inherent high thermal conductivity, the net result is significantly lower thermal resistance, 7-10 x 10-6 K•m2/W; much less than standard thermally conductive epoxies. Some other desirable features of EP30TC are its outstanding electrical insulation, very low shrinkage upon curing, excellent dimensional stability and low CTE. Prior to mixing, EP30TC should be refrigerated but not frozen. The service temperature range is -100°F to +300°F. The color of Part A is gray and Part B is clear. This sophisticated system can be used in applications in aerospace, electronic, optical and OEM applications.

Product Advantages:

  • Lower viscosity, good flow properties
  • High thermal conductivity and electrical insulation
  • Can be applied in very thin sections
  • Exceptional compressive strength
  • Outstanding abrasion resistance
  • Meets NASA low outgassing specifications

Information provided by Masterbond.

Vendors: Master Bond is a leading manufacturer of adhesives, sealants, coatings and potting compounds. Master Bond’s vast product line consists of over 3,000 epoxy, polyurethane, silicone, cyanoacrylate and latex adhesives that vary in viscosity, cure speed, strength, chemical resistance, electrical properties, etc. Our custom adhesives offer design flexibility and provide excellent bonding performance. Visit www.masterbond.com.

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Physical PropertiesOriginal ValueComments
Viscosity 280 - 500 cPPart B
 14000 - 28000 cPPart A
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore D 85 - 95
Tensile Strength 5000 - 6000 psi
Tensile Modulus 500000 - 550000 psi
Compressive Strength 24000 - 26000 psi
Adhesive Bond Strength 600 - 800 psilap shear, Al/Al
Taber Abrasion, mg/1000 Cycles 54.1CS-17 wheel
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity >= 1.00e+14 ohm-cm
Dielectric Constant 4.7
@Frequency 60 Hz
Dielectric Strength >= 400 V/mil
@Thickness 3.17 mm
 
Thermal PropertiesOriginal ValueComments
Maximum Service Temperature, Air 300 °F
Minimum Service Temperature, Air -100 °F
 
Processing PropertiesOriginal ValueComments
Cure Time 2.00 - 3.00 hour
@Temperature 93.3 °C
 48.0 - 72.0 hour
@Temperature 23.9 °C
Working Life 90.0 - 120 minAfter mixing, 100 g batch
Shelf Life 6.00 Month
@Temperature 4.44 - 10.0 °C
In original unopened containers
 
Descriptive Properties
Cure scheduleOvernight at 75°F plus 2-3 hours at 150-200°FOptimum
Mixing Ratio10:1Parts A to B, by weight

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PMASTM714 / 233771

Metal adhesives

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