Appearance: Silver Product Benefits: - Electrically conductive
- Snap curable after B-stage
- High adhesion to metal leadframe surface
- Excellent printing and low surface roughness
- No voiding after cure
Cure: Heat cureApplication: Die attach LOCTITE ABLESTIK 8008 snap curable adhesive is designed for small die sizes (<3mm). It exhibits moderate electrical and thermal conductivity. This material can be applied to a wafer backside by stencil printing and then B-staged in an oven. The adhesive can then be cured after die attach in an in-line process exhibiting a consistent, void-free bondline without bleed. LOCTITE ABLESTIK 8008 should be used with a pressure sensitive dicing tape and is not compatible with UV dicing tapes. Information provided by Loctite® |