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Metal adhesives

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Henkel Loctite® ABLESTIK 8008 Adhesive
Categories: Polymer; Adhesive

Material Notes: Appearance: Silver

Product Benefits:

  • Electrically conductive
  • Snap curable after B-stage
  • High adhesion to metal leadframe surface
  • Excellent printing and low surface roughness
  • No voiding after cure
Cure: Heat cure

Application: Die attach

LOCTITE ABLESTIK 8008 snap curable adhesive is designed for small die sizes (<3mm). It exhibits moderate electrical and thermal conductivity. This material can be applied to a wafer backside by stencil printing and then B-staged in an oven. The adhesive can then be cured after die attach in an in-line process exhibiting a consistent, void-free bondline without bleed. LOCTITE ABLESTIK 8008 should be used with a pressure sensitive dicing tape and is not compatible with UV dicing tapes.

Information provided by Loctite®

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
pH 4.7
Brookfield Viscosity 48000 cPUncured, CP51, Speed 5 rpm
 
Mechanical PropertiesOriginal ValueComments
Tensile Modulus 1800 MPa
@Temperature 250 °C
Cured, DMTA
 2521 MPa
@Temperature 200 °C
Cured, DMTA
 3161 MPa
@Temperature 150 °C
Cured, DMTA
 5451 MPa
@Temperature 25.0 °C
Cured, DMTA
 8442 MPa
@Temperature -65.0 °C
Cured, DMTA
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 0.00010 ohm-cm
 
Thermal PropertiesOriginal ValueComments
CTE, linear 42.0 µm/m-°CCured, Below Tg
 67.0 µm/m-°CCured, Above Tg
Thermal Conductivity 2.20 W/m-KCured
Glass Transition Temp, Tg 270 °CCured, TMA
 
Processing PropertiesOriginal ValueComments
Cure Time 30.0 minramp to 175°C + 60 minutes @ 175°C
 0.330 min
@Temperature 280 °C
Alternate Snap Cure Condition
 1.00 min
@Temperature 230 °C
Recommended Snap Cure Condition
Working Life 24.0 hour
Shelf Life 12.0 Month
@Temperature -40.0 °C
Uncured, from date of manufacture
 
Descriptive Properties
Shear Strength2.6 kg-fDie, 2 x 2 mm Si die on Ag/Cu LF @ 260°C
 6 kg-fDie, 2 x 2 mm Si die on Ag/Cu LF @ 25°C
Thixotropic Index2.6Uncured, 0.5/5 rpm
Water Extract Conductivity45 µmhos/cmCured

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PLOCT5023 / 255234

Metal adhesives

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