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USP Class VI Adhesives
USP Class VI Approved Adhesives for Medical Device Applications
Master Bond’s biocompatible adhesives are designed to meet the needs of medical device manufacturers. Compounds withstand various types of sterilization methods.

BASF Ultraform® S 2320 003 PRO AT POM
Categories: Polymer; Thermoplastic; Acetal (Polyoxymethylene, POM); Acetal Copolymer, Unreinforced

Material Notes: Product Description: Ultraform® S 2320 003 PRO AT is a very easy flowing and rapidly freezing injection molding POM grade. This grade was developed for the medical device market. This grade complies with US Pharmacopeia: Biological Reactivity Tests, USP Plastic Class VI (USP VI), ISO 10993-5: Biological Evaluation of Medical Devices Part 5: Test for Cytotoxicity, DMF: A Drug Master File (DMF) has been registered at FDA for Ultraform® PRO and Food Contact: Ultraform® PRO is in compliance with multiple regional food contact regulations, especially for Europe and United States. Typical applications include functional parts in medical devices.

Availability: North America

Features: Food Contact Acceptable; Good Flow

Use: Medical/Healthcare Applications

Agency Ratings: DMF; EC 1907/2006 (REACH); FDA Food Contact; ISO 10993 Part 5; USP Class VI

RoSH Compliance: RoSH Compliant

Processing Method: Injection Molding

Information provided by BASF Corporation

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesMetricEnglishComments
Density 1.41 g/cc0.0509 lb/in³ISO 1183
Water Absorption 0.20 %0.20 %Equilibrium, 50% RH; ISO 62
Water Absorption at Saturation 0.90 %0.90 %ISO 62
Maximum Moisture Content 0.150.15
Linear Mold Shrinkage, Flow 0.021 cm/cm0.021 in/inISO 294-4
Linear Mold Shrinkage, Transverse 0.021 cm/cm0.021 in/inISO 294-4
Melt Flow 11 g/10 min
@Load 2.16 kg,
Temperature 190 °C
11 g/10 min
@Load 4.76 lb,
Temperature 374 °F
ISO 1133
 
Mechanical PropertiesMetricEnglishComments
Tensile Strength, Yield 64.0 MPa9280 psiISO 527-2
Elongation at Break 29 %29 %Nominal; ISO 527-2
Elongation at Yield 10 %10 %ISO 527-2
Tensile Modulus 2.70 GPa392 ksiISO 527-1
Izod Impact, Notched (ISO)  5.46 kJ/m²
@Temperature -30.0 °C
2.60 ft-lb/in²
@Temperature -22.0 °F
ISO 180
 5.46 kJ/m²
@Temperature 22.8 °C
2.60 ft-lb/in²
@Temperature 73.0 °F
ISO 180
Charpy Impact Unnotched  23.1 J/cm²
@Temperature -30.0 °C
110 ft-lb/in²
@Temperature -22.0 °F
ISO 179
 25.2 J/cm²
@Temperature 22.8 °C
120 ft-lb/in²
@Temperature 73.0 °F
ISO 179
Charpy Impact, Notched  0.546 J/cm²
@Temperature -30.0 °C
2.60 ft-lb/in²
@Temperature -22.0 °F
ISO 179
 0.609 J/cm²
@Temperature 22.8 °C
2.90 ft-lb/in²
@Temperature 73.0 °F
ISO 179
Tensile Creep Modulus, 1000 hours 1300 MPa189000 psiISO 899-1
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 1.00e+13 ohm-cm1.00e+13 ohm-cmIEC 60093
Surface Resistance 1.00e+13 ohm1.00e+13 ohmIEC 60093
Dielectric Constant 3.8
@Frequency 1e+6 Hz
3.8
@Frequency 1e+6 Hz
IEC 60250
Dissipation Factor 0.0050
@Frequency 1e+6 Hz
0.0050
@Frequency 1e+6 Hz
IEC 60250
Comparative Tracking Index 600 V600 VSolution A; IEC 60112
 
Thermal PropertiesMetricEnglishComments
CTE, linear, Parallel to Flow 110 µm/m-°C61.0 µin/in-°FISO 11359-2
Melting Point 167 °C333 °FISO 3146
Deflection Temperature at 1.8 MPa (264 psi) 100 °C212 °FUnannealed; ISO 75-2/A
 
Processing PropertiesMetricEnglishComments
Melt Temperature 190 - 230 °C374 - 446 °F
Mold Temperature 60.0 - 120 °C140 - 248 °F
Drying Temperature 80.0 - 110 °C176 - 230 °F
Dry Time 2.00 - 4.00 hour2.00 - 4.00 hour
Injection Pressure 3.50 - 7.03 MPa508 - 1020 psi

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PBASG2122 / 310815

USP Class VI adhesives

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