Appearance: Red Cure: Heat cure Product Benefits: - One component
- Low stress
- Snap curable
- Low cure temperature
- Good dispense behavior
- Compatible for use with encapsulant material
Application: Die attach Filler Type Silica Typical Package Application: Smart Card LOCTITE ABLESTIK ABP 2035SCR non-conductive die attach adhesive has been formulated for use in high throughput die attach applications. This material is designed to minimize stress and resulting warpage between dissimilar surfaces. Information provided by Loctite® |