MatWeb - Material Property Data Advertise with MatWeb!     Register Now
Data sheets for over 180,000 metals, plastics, ceramics, and composites.
MatWeb - Material Property Data HOME  •   SEARCH  •   TOOLS  •   SUPPLIERS  •   FOLDERS  •   ABOUT US  •   FAQ  •   LOG IN    
Recently Viewed Materials (most recent at top)  

Login to see your most recently viewed materials here.

Or if you don't have an account with us yet, then click here to register.

  Searches:   Advanced  | Category  | Property  | Metals  | Trade Name  | Manufacturer  | Recently Viewed Materials
  

Chemically Resistant adhesives

(Viewing data as-entered. Click here to return)
Master Bond EP17HTND-CCM One component, high temperature epoxy system for bonding and sealing
Categories: Polymer; Thermoset; Epoxy; Epoxy, High Temperature

Material Notes: Key Features:
  • Ideal for glob top applications
  • Resists temperatures up to +600°F
  • Excellent chemical resistance
  • Meets NASA low outgassing specifications
Master Bond EP17HTND-CCM is a one component, heat cured epoxy system for bonding, sealing and glob top applications. It requires no mixing and cures readily at 300- 350°F. Typical curing schedules are 2 hours at 300°F or 1-2 hours at 350°F. Curing in this manner will result in a glass transition temperature (Tg) of 200-210°C. EP17HTND-CCM has a great flow profile for glob top applications and is black as well. This epoxy system features excellent physical properties, superb electrical insulation along with good thermal conductivity, even at elevated temperatures. This system is also distinctive in that it has a relatively low exotherm upon curing. EP17HTND-CCM is 100% reactive and contains no solvents or diluents. EP17HTND-CCM bonds well to similar and dissimilar substrates such as metal, ceramics, plastics and composites. It has a noteworthy resistance to many chemicals including acids, bases, salts, fuels, oils and many solvents. Significantly, It has minimal shrinkage upon curing. Its service temperature range is from -80°F to +600°F. Since it passes NASA low outgassing, it can be used in vacuum type situations and other applications where that requirement is needed. EP17HTND-CCM is used primarily as a glob top and sealing material in electronic applications where high temperature resistance and good electrical properties at these high temperatures is needed.

Product Advantages:

  • Single component system; no mixing prior to use
  • High temperature resistance
  • Very good electrical insulation properties, even at higher temperatures
  • Black color
  • Ideal flow profile for glob topping
  • Good thermal conductivity

Information provided by Masterbond.

Vendors: Master Bond is a leading manufacturer of adhesives, sealants, coatings and potting compounds. Master Bond’s vast product line consists of over 3,000 epoxy, polyurethane, silicone, cyanoacrylate and latex adhesives that vary in viscosity, cure speed, strength, chemical resistance, electrical properties, etc. Our custom adhesives offer design flexibility and provide excellent bonding performance. Visit www.masterbond.com.

Click here to view all available suppliers for this material.

Please click here if you are a supplier and would like information on how to add your listing to this material.

 
Physical PropertiesOriginal ValueComments
Solids Content 100 %
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore D 80 - 90
Tensile Strength 10000 - 12000 psi
Tensile Modulus 400000 - 450000 psi
Compressive Strength 20000 - 22000 psi
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity <= 1.00e+12 ohm-cm
@Temperature 400 °C
 <= 1.00e+15 ohm-cm
@Temperature 75.0 °C
Dielectric Constant 4.4
@Frequency 60 Hz,
Temperature 75.0 °C
 4.7
@Frequency 60 Hz,
Temperature 400 °C
Dissipation Factor 0.0080
@Frequency 60 Hz,
Temperature 75.0 °C
 0.018
@Frequency 60 Hz,
Temperature 400 °C
 
Thermal PropertiesOriginal ValueComments
Thermal Conductivity 1.4423 W/m-K
Glass Transition Temp, Tg 200 - 210 °C
 
Processing PropertiesOriginal ValueComments
Cure Time 1.00 - 2.00 hour
@Temperature 177 °C
 2.00 hour
@Temperature 149 °C
Shelf Life 3.00 - 6.00 Month
@Temperature 4.44 - 7.22 °C
in original, unopened containers
 
Descriptive Properties
Viscosityflowable paste

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to go back to viewing the property data in MatWeb's normal format.

Users viewing this material also viewed the following:
Overview of materials for Epoxy, Molded, Mineral Filled
Master Bond EP17HTDA-1 One component, high temperature epoxy system for bonding and sealing
Lord Adhesives CoolTherm™ EP-2000 Thermally Conductive Epoxy Encapsulant
Epoxy Technology EPO-TEK® OE188 High Temperature Silica-Filled Epoxy
Cookson Group Plaskon® 435 Mineral Filled Epoxy Molding Compound

PMASTM707 / 233764

Chemically Resistant adhesives

Please read our License Agreement regarding materials data and our Privacy Policy. Questions or comments about MatWeb? Please contact us at webmaster@matweb.com. We appreciate your input.

The contents of this web site, the MatWeb logo, and "MatWeb" are Copyright 1996-2024 by MatWeb, LLC. MatWeb is intended for personal, non-commercial use. The contents, results, and technical data from this site may not be reproduced either electronically, photographically or substantively without permission from MatWeb, LLC.