Henkel Loctite® ABLESTIK 8390 Epoxy

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Henkel Loctite® ABLESTIK 8390 Epoxy
Categories:	Polymer; Thermoset; Epoxy
Material Notes:	Appearance: Silver Product Benefits: Minimal resin bleed Thermally conductive Electrically conductive In-line oven snap cure Low condensable volatiles Moderately stress absorbing Compatible for use with palladium Excellent dispensability, minimal tailing and stringing Cure: Heat cure Application: Die attach Filler Type: Silver Substrates: Silver-plated copper leadframes, Palladiumplated copper leadframes and Silver-plated Alloy 42 leadframes LOCTITE ABLESTIK 8390 die attach adhesive has been formulated for use in high throughput die attach applications. It is suitable for die sizes up to 8 x 8 mm. Information provided by Loctite®
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Physical Properties	Original Value	Comments

Moisture Absorption	1.10 % @Temperature 85.0 °C	Saturation, after 85% RH exposure
pH	6.2
Brookfield Viscosity	8700 cP	Uncured, CP51, Speed 5 rpm

Mechanical Properties	Original Value	Comments
Tensile Modulus	517 MPa @Temperature 250 °C	Cured, DMTA
	1390 MPa @Temperature 150 °C	Cured, DMTA
	4650 MPa @Temperature 25.0 °C	Cured, DMTA
	6330 MPa @Temperature -65.0 °C	Cured, DMTA

Thermal Properties	Original Value	Comments
CTE, linear	60.0 µm/m-°C	Cured, Below Tg
	135 µm/m-°C	Cured, Above Tg
Thermal Conductivity	1.80 W/m-K @Temperature 121 °C
Glass Transition Temp, Tg	73.0 °C	Cured, TMA

Processing Properties	Original Value	Comments
Cure Time	1.33 min	Snap Cure Condition, 7-Zone Oven: Temp per zone: 160ºC, 150ºC, 155ºC, 155ºC, 160ºC, 175ºC, 220ºC
	15.0 min @Temperature 175 °C
Working Life	48.0 hour
Shelf Life	12.0 Month	Uncured, from date of manufacture

Descriptive Properties
Extractable Ionic Content (ppm)	<10	Cured, Sodium (Na+), @ 100°C
	<20	Cured, Chloride (Cl-),@ 100°C
	<5	Cured, Potassium (K+), @ 100°C
Shear Strength	1.0 kg-f	Die, 3 X 3 mm Si die, after 85ºC/85% RH exposure for 168 hours, Snap Cured, On Ag/Cu LF @ 200°C
	1.1 kg-f	Die, 3 X 3 mm Si die, after 85ºC/85% RH exposure for 168 hours, Snap Cured, On Bare Cu LF @ 200°C
	1.2 kg-f	Die, 3 X 3 mm Si die, Snap Cured, On Ag/Cu LF @ 250°C
	1.3 kg-f	Die, 3 X 3 mm Si die, after 85ºC/85% RH exposure for 168 hours, Snap Cured, On Pd/Ni/Cu LF @ 200°C
	1.8 kg-f	Die, 3 X 3 mm Si die, Snap Cured, On Pd/Ni/Cu LF @ 250°C
	10 kg-f	Die, 3 X 3 mm Si die, after 85ºC/85% RH exposure for 168 hours, Snap Cured, On Bare Cu LF @ 25°C
	11 kg-f	Die, 2 x 2 mm Si die on Ag/Cu LF
	13 kg-f	Die, 3 X 3 mm Si die, Snap Cured, On Bare Cu LF @ 25°C
	14 kg-f	Die, 3 X 3 mm Si die, after 85ºC/85% RH exposure for 168 hours, Oven Cured, On Ag/Cu LF @ 25°C
	17 kg-f	Die, 3 X 3 mm Si die, after 85ºC/85% RH exposure for 168 hours, Snap Cured, On Ag/Cu LF @ 25°C
	18 kg-f	Die, 3 X 3 mm Si die, after 85ºC/85% RH exposure for 168 hours, Snap Cured, On Pd/Ni/Cu LF @ 25°C
	18 kg-f	Die, 3 X 3 mm Si die, Snap Cured, On Pd/Ni/Cu LF @ 25°C
	2.4 kg-f	Die, 3 X 3 mm Si die, Snap Cured, On Ag/Cu LF @ 200°C
	2.7 kg-f	Die, 3 X 3 mm Si die, Snap Cured, On Bare Cu LF @ 250°C
	20 kg-f	Die, 3 X 3 mm Si die, Snap Cured, On Ag/Cu LF @ 25°C
	24 kg-f	Die, 3 X 3 mm Si die, Oven Cured, On Ag/Cu LF @ 25°C
	3 kg-f	Die, 3 X 3 mm Si die, Snap Cured, On Bare Cu LF @ 200°C
	3 kg-f	Die, 3 X 3 mm Si die, after 85ºC/85% RH exposure for 168 hours, Oven Cured, On Ag/Cu LF @ 200°C
	3.1 kg-f	Die, 3 X 3 mm Si die, Oven Cured, On Ag/Cu LF @ 250°C
	3.5 kg-f	Die, 3 X 3 mm Si die, Snap Cured, On Pd/Ni/Cu LF @ 200°C
	4.8 kg-f	Die, 3 X 3 mm Si die, Oven Cured, On Ag/Cu LF @ 200°C
Thixotropic Index	>3.1	Uncured, 0.5/5 rpm
Water Extract Conductivity	18 µmhos/cm
Weight Loss (%)	0.6	300ºC
	1	10 x 10 mm Si die on glass slide

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PLOCT5034 / 255245

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