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Chemically Resistant adhesives

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Master Bond EP3UF-1 One component epoxy for bonding and underfill applications
Categories: Polymer; Thermoset; Epoxy; Epoxy Adhesive

Material Notes: Key Features:
  • Thermally conductive
  • Excellent electrical insulator
  • Low viscosity
  • Ultra fine particle size
Master Bond EP3UF-1 is a one component, highly flowable epoxy for bonding and underfill applications. It is easily cured at elevated temperatures as low as 250°F. It is not premixed and frozen and has unlimited working life at room temperatures. Curing is simple and straightforward; 20-30 minutes at 250°F or 10-15 minute at 300°F. EP3UF-1 is distinguished by being thermally conductive and electrically insulative by using very special filler material with ultra small particle sizes. These granules allow EP3UF-1 to be used as an underfill in spaces as small as 10-15 microns wide. As an underfill system, EP3UF-1 has high mechanical strength properties, outstanding dimensional stability and low shrinkage upon curing. EP3UF-1 also is a highly useful thermally conductive adhesive. Since the filler is thermally conductive and the particle size very small, as mentioned above, it can be applied in thin bond lines of 10-15 microns. This, in effect, lowers the thermal resistance and effectively increases the heat transfer properties of the system. For example, with a typical thermally conductive filler, a reasonable bond line thickness is about 50 microns. With this epoxy, the thermal resistance would be 30-50 x 10-6 K•m2/W. However, when an epoxy such as EP3UF-1 is applied in thickness of 10-15 microns, the thermal resistance drops to 5-7 x 10-6 K•m2/W. This is helpful in managing heat related issues. Some other attributes of this system include the ability to bond well to a variety of substrates such as metals, composites, ceramics and many plastics. It has reasonably good resistance to a wide variety of waters, oils and fuels. The color of EP3UF-1 is light yellow. The service temperature range is -60°F to +250°F. EP3UF-1 is a highly effective thermal interface material for bonding and underfill applications in microelectronic packaging and assembly.

Product Advantages:

  • One component; no mixing; not premixed and frozen
  • Unlimited working life at room temperature
  • Exceptional flow properties
  • Rapid curing with versatile cure schedules
  • Can be used as an underfill for very tight spaces
  • Small particle size lowers thermal resistance

Information provided by Masterbond.

Vendors: Master Bond is a leading manufacturer of adhesives, sealants, coatings and potting compounds. Master Bond’s vast product line consists of over 3,000 epoxy, polyurethane, silicone, cyanoacrylate and latex adhesives that vary in viscosity, cure speed, strength, chemical resistance, electrical properties, etc. Our custom adhesives offer design flexibility and provide excellent bonding performance. Visit www.masterbond.com.

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Physical PropertiesOriginal ValueComments
Solids Content 100 %
Viscosity 5000 - 15000 cPthixotropic
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore D 80 - 90
Tensile Strength 5000 - 7000 psi
Tensile Modulus 450000 - 500000 psi
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity >= 1.00e+14 ohm-cm
Dielectric Constant 4.5
@Frequency 60 Hz
Dielectric Strength 450 V/mil
@Thickness 3.17 mm
 
Thermal PropertiesOriginal ValueComments
Thermal Conductivity 1.4423 W/m-K
Maximum Service Temperature, Air 250 °F
Minimum Service Temperature, Air -60.0 °F
 
Processing PropertiesOriginal ValueComments
Cure Time 10.0 - 15.0 min
@Temperature 149 °C
 20.0 - 30.0 min
@Temperature 121 °C
Shelf Life 6.00 Month

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PMASTM704 / 233761

Chemically Resistant adhesives

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