Henkel Loctite® ABLESTIK 2035SC Adhesive

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Henkel Loctite® ABLESTIK 2035SC Adhesive
Categories:	Polymer; Adhesive
Material Notes:	Appearance: Red Product Benefits: Non-conductive Single component Fast cure Low cure temperature Low stress Cure: Heat cure Application: Die attach LOCTITE ABLESTIK 2035SC non-conductive die attach adhesive has been formulated for use in high throughput die attach applications. This material is designed to minimize stress and resulting warpage between dissimilar surfaces. Information provided by Loctite®
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Physical Properties	Original Value	Comments

pH	3.7
Brookfield Viscosity	11000 cP	Uncured, CP51, Speed 5 rpm

Mechanical Properties	Original Value	Comments
Tensile Modulus	68.0 MPa @Temperature 200 °C	Cured, DMTA
	70.0 MPa @Temperature 150 °C	Cured, DMTA
	2500 MPa @Temperature 25.0 °C	Cured, DMTA
	3700 MPa @Temperature -65.0 °C	Cured, DMTA

Thermal Properties	Original Value	Comments
CTE, linear	54.0 µm/m-°C	Cured, Below Tg
	128 µm/m-°C	Cured, Above Tg
Thermal Conductivity	0.350 W/m-K	Cured
Glass Transition Temp, Tg	120 °C	Cured, TMA

Processing Properties	Original Value	Comments
Cure Time	0.167 min @Temperature 150 °C	Alternative Cure Schedule 2
	1.00 min @Temperature 120 °C	Alternative Cure Schedule 1
	1.50 min @Temperature 110 °C
Working Life	24.0 hour
Shelf Life	12.0 Month @Temperature -40.0 °C	Uncured, from date of manufacture

Descriptive Properties
Extractable Ionic Content (ppm)	<20	Cured, Potassium (K+)
	<30	Cured, Chloride (Cl-)
	<90	Cured, Sodium (Na+)
Shear Strength	11 kg-f	Die, 2 X 2 mm die size, Au die on Au PBGA
	12 kg-f	Die, 2 X 2 mm die size, Si die on Pd leadframe
	12 kg-f	Die, 2 X 2 mm die size, Si die on PBGA-FR4
	13 kg-f	Die, 2 X 2 mm die size, Si die on Ag leadframe
	25 kg-f	Die, 3 X 3 mm Si die on PBGA-FR4 @ 25ºC
	4 kg-f	Die, 3 X 3 mm Si die on PBGA-FR4 @ 200°C
	7 kg-f	Die, 3 X 3 mm Si die on PBGA-FR4 @ 150ºC
Thixotropic Index	4.2	Uncured, 0.5/5 rpm
Water Extract Conductivity	<75 µmhos/cm	Cured
Weight Loss (%)	2.51	Cure, 300ºC

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PLOCT5015 / 255226

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