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Master Bond adhesives

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Henkel Loctite® ABLESTIK 2053S Epoxy
Categories: Polymer; Thermoset; Epoxy

Material Notes: Appearance: Red

Product Benefits:

  • Non-conductive
  • Low stress
Cure: Heat cure

Application: Die attach

LOCTITE ABLESTIK 2053S die attach adhesive is designed for use in array packaging.

Information provided by Loctite®

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
Moisture Absorption 1.00 %Saturation, after 85% RH exposure
Brookfield Viscosity 13000 cPUncured, CP51, Speed 5 rpm
 
Mechanical PropertiesOriginal ValueComments
Tensile Modulus 12.0 MPa
@Temperature 150 °C
Cured, DMTA
 22.0 MPa
@Temperature 250 °C
Cured, DMTA
 87.0 MPa
@Temperature 25.0 °C
Cured, DMTA
 1379 MPa
@Temperature -65.0 °C
Cured, DMTA
 
Thermal PropertiesOriginal ValueComments
CTE, linear 149 µm/m-°CCured, Below Tg
 216 µm/m-°CCured, Above Tg
Glass Transition Temp, Tg -21.0 °CCured, TMA
 
Processing PropertiesOriginal ValueComments
Cure Time 30.0 min@ 175°C + 15 minutes @ 175°C
Working Life 24.0 hour
Shelf Life 12.0 Month
@Temperature -40.0 °C
Uncured, from date of manufacture
 
Descriptive Properties
Extractable Ionic Content (ppm)<10Cured, Chloride (Cl-)
 <10Cured, Sodium (Na+)
 <10Cured, Potassium (K+)
Shear Strength15.5 kg-f3 x 3 mm Si die on PBGA @ 25°C
 2.1 kg-f3 x 3 mm Si die on PBGA @ 260°C
 6 kg-fDie, 2 x 2 mm Si die on Ag/Cu LF
Thixotropic Index2.5Uncured, 0.5/5 rpm
Weight Loss (%)2.3Cure, 300ºC
 3.26Cure, 10 x 10 mm Si die on glass slide

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PLOCT5016 / 255227

Rulon Bearings

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