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Chemically Resistant adhesives

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ASI® MP 5401 Epoxy Adhesive
Categories: Polymer; Thermoset; Epoxy; Epoxy Adhesive

Material Notes: MP 5401 is a one component, heat curable thixotropic paste epoxy adhesive. It is a non-sag adhesive, which forms strong bonds to metals and ceramics. MP 5401 has exceptional thermal stability and resistance to water, humidity and solvents. This product offers high heat resistance and cures in less than 36 seconds via induction or infrared heating.

Information provided by Adhesive Systems, Inc.

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
Specific Gravity 1.46 g/cc
@Temperature 25.0 °C
Viscosity 700000 - 900000 cP
@Temperature 25.0 °C
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore D 86
@Temperature 25.0 °C
Tensile Strength 6770 psi
Elongation at Break >= 1.5 %
Adhesive Bond Strength 3200 psiLap Shear
Izod Impact, Notched 0.360 ft-lb/in
 
Thermal PropertiesOriginal ValueComments
CTE, linear 57.2 µm/m-°C
Thermal Conductivity 19.6 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 400 °F
Minimum Service Temperature, Air -40.0 °F
Glass Transition Temp, Tg 148 °C
 
Processing PropertiesOriginal ValueComments
Cure Time 1.00 min
@Temperature 177 °C
 2.00 min
@Temperature 149 °C
 10.0 min
@Temperature 121 °C
Shelf Life 0.500 Month
@Temperature 38.0 °C
 6.00 Month
@Temperature 24.0 °C
 12.0 Month
@Temperature <=0.000 °C
Store in a cool, dry area
 
Descriptive Properties
Color / appearancegray
Press Flow70-90 sec
Sag Resistance0.375"-0.42"
Unleaded Gasoline Resistance100% strength retained after 1500 hrs of submersion.

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PASINC9100 / 233467

Chemically Resistant adhesives

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