ASI® MP 5405 Epoxy Adhesive

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ASI® MP 5405 Epoxy Adhesive
Categories:	Polymer; Thermoset; Epoxy; Epoxy Adhesive
Material Notes:	MP5405 is a two part unfilled epoxy adhesive designed for ceramics, and most plastics. It cures to a tough semi-rigid material, and is a free flowing viscosity. It gives good resistance to water, salt spray, inorganic acids and bases, and most organic solvents. It was formulated to a 1:1 mix ratio for use in either MMD equipment or side-by side dual cartridges for easy dispensing. Information provided by Adhesive Systems, Inc.
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Physical Properties	Original Value	Comments

Specific Gravity	1.15 g/cc @Temperature 25.0 °C	part B
	1.16 g/cc @Temperature 25.0 °C	part A
	1.16 g/cc @Temperature 25.0 °C	mixed
Viscosity	12000 cP @Temperature 25.0 °C	part A
	12500 cP @Temperature 25.0 °C	mixed
	13000 cP @Temperature 25.0 °C	part B

Mechanical Properties	Original Value	Comments
Hardness, Shore D	80 @Temperature 25.0 °C
Tensile Strength	7000 psi @Temperature 25.0 °C
Elongation at Break	3.0 - 5.0 % @Temperature 25.0 °C
Adhesive Bond Strength	2300 psi	Lap Shear; Al to Al

Electrical Properties	Original Value	Comments
Volume Resistivity	>= 8.00e+14 ohm-cm @Temperature 25.0 °C
Dielectric Constant	4.5 @Frequency 100 Hz, Temperature 25.0 °C
Dielectric Strength	410 V/mil @Temperature 25.0 °C

Thermal Properties	Original Value	Comments
Maximum Service Temperature, Air	130 °C
Minimum Service Temperature, Air	-40.0 °C

Processing Properties	Original Value	Comments
Pot Life	3.00 - 5.00 min @Temperature 25.0 °C	20 grams
Shelf Life	24.0 Month @Temperature 10.0 - 24.0 °C	Unopened container stored in a dry area

Descriptive Properties
Color / appearance	clear
Mix Ratio	1 to 1 by weight or volume @ 25°C

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PASINC9080 / 233447

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