Henkel Loctite® ABLESTIK ABP 8068TA Conductive Adhesive

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Henkel Loctite® ABLESTIK ABP 8068TA Conductive Adhesive
Categories:	Polymer; Adhesive
Material Notes:	Appearance: Grey Liquid Cure: Heat cure Product Benefits: One component Dispensable Printable Excellent workability Low sintering temperature Good sintering properties when used on Ag, PPF, Au and Cu substrates High thermal stability Good toughness High reliability Solder replacement Void-free bondline Application: Semiconductor, Conductive adhesive Filler Type: Silver Typical Package Application: QFN, LGA, HBLED LOCTITE ABLESTIK ABP 8068TA is a semi-sintering die attach adhesive designed for semiconductor packages requiring high thermal and electrical conductivity. This material’s epoxy assisted sintering formulation is designed to provide high adhesion, high thermal and low stress properties which are essential for thermal and reliability performances of high end power packages. The thermal performance of LOCTITE ABLESTIK ABP 8068TA is comparable to a solder paste material. In conventional box oven curing, it will cure at 1 hour at 200ºC or 175ºC. Information provided by Loctite®
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Physical Properties	Original Value	Comments

Moisture Absorption	0.260 %
Brookfield Viscosity	9000 cP	Uncured, CP51, Speed 5 rpm

Mechanical Properties	Original Value	Comments
Tensile Modulus	1500 MPa @Temperature 250 °C	Cured, Dynamic, DMA
	2100 MPa @Temperature 150 °C	Cured, Dynamic, DMA
	11800 MPa @Temperature 25.0 °C	Cured, Dynamic, DMA
	15800 MPa @Temperature -65.0 °C	Cured, Dynamic, DMA

Electrical Properties	Original Value	Comments
Volume Resistivity	0.0000090 ohm-cm

Thermal Properties	Original Value	Comments
CTE, linear	54.0 µm/m-°C	Cured, TMA
Thermal Conductivity	110 W/m-K

Processing Properties	Original Value	Comments
Cure Time	20.0 min	ramp from 25°C to 130°C, hold for 30 to 60 minutes; 15 minutes ramp to 200°C, hold for 60 minutes in N2 or air oven, For the die size <5 x 5 mm
	20.0 min	ramp from 25°C to 130°C, hold for 120 minutes; 15 minutes ramp to 200°C, hold for 60 minutes in N2 or air oven, For the die size >5 x 5 mm
	20.0 min	ramp from 25°C to 130°C, hold for 30 minutes; 10 minutes ramp to 175°C, hold for 60 minutes in N2 or air oven, Alternate Cure Schedule, Suitable for Ag, Au and PPF substrates
Working Life	2.00 hour	Open time
	24.0 hour
Shelf Life	12.0 Month @Temperature -40.0 °C	Uncured, from date of manufacture

Descriptive Properties
Extractable Ionic Content (ppm)	3	Cured, Sodium (Na+)
	3	Cured, Potassium (K+)
	35	Cured, Chloride (Cl-)
Shear Strength	0.64 kg	1 x 1 mm die after Parr bomb on Cu
	0.9 kg	1 x 1 mm die on Cu
	0.99 kg	1 x 1 mm die after Parr bomb on Ag
	1.09 kg	1 x 1 mm die after Parr bomb on PPF
	1.12 kg	1 x 1 mm die on Ag
	1.22 kg	1 x 1 mm die on PPF
	10.2 kg	3 x 3 mm die on Cu
	11.4 kg	3 x 3 mm die after Parr bomb on PPF
	11.7 kg	3 x 3 mm die on PPF
	13.1 kg	3 x 3 mm die on Ag
	13.5 kg	3 x 3 mm die after Parr bomb on Cu
	14.5 kg	3 x 3 mm die after Parr bomb on Ag
	15.6 kg	5 x 5 mm die after Parr bomb on PPF
	15.9 kg	5 x 5 mm die on PPF
	17.9 kg	5 x 5 mm die on Cu
	19.4 kg	5 x 5 mm die after Parr bomb on Ag
	20.2 kg	5 x 5 mm die on Ag
	20.8 kg	5 x 5 mm die after Parr bomb on Cu
	4.4 kg	2 x 2 mm die on Cu
	4.6 kg	2 x 2 mm die after Parr bomb on Cu
	6.4 kg	2 x 2 mm die after Parr bomb on PPF
	6.9 kg	2 x 2 mm die after Parr bomb on Ag
	7.2 kg	2 x 2 mm die on PPF
	7.3 kg	2 x 2 mm die on Ag
Thixotropic Index	6	Uncured, 0.5/5 rpm
Weight Loss (%)	-4	on Cure

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PLOCT5041 / 255252

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