Henkel Loctite® ABLESTIK ABP 6892 Adhesive

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Henkel Loctite® ABLESTIK ABP 6892 Adhesive
Categories:	Other Engineering Material
Material Notes:	Appearance: Clear paste Cure: Heat cure Product Benefits: Non-conductive Halogen free Low modulus Low viscosity Low outgassing Low moisture absorption Good adhesion to a variety of substrates Application: Die attach LOCTITE ABLESTIK ABP 6892 non-conductive die attach paste is designed for applications requiring low stress and robust mechanical properties. A package using this material will have a greater resistance to delamination and overall improvement in package reliability. Information provided by Loctite®
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Physical Properties	Original Value	Comments

Moisture Absorption	0.440 % @Temperature 85.0 °C	85% RH
Brookfield Viscosity	4100 cP	Speed 0.5 rpm
Outgassing - Total Mass Loss	0.70 %	during cure

Mechanical Properties	Original Value	Comments
Tensile Modulus	24.0 MPa @Temperature 150 °C	Cured, DMTA
	28.0 MPa @Temperature 100 °C	Cured, DMTA
	34.0 MPa @Temperature 250 °C	Cured, DMTA
	176 MPa @Temperature 25.0 °C	Cured, DMTA
	1912 MPa @Temperature -65.0 °C	Cured, DMTA

Thermal Properties	Original Value	Comments
CTE, linear	111.4 µm/m-°C	Cured, Below Tg
	190.6 µm/m-°C	Cured, Above Tg
Glass Transition Temp, Tg	-24.6 °C	Cured, TMA

Processing Properties	Original Value	Comments
Cure Time	15.0 min	ramp to 80ºC, hold 60 minutes
	15.0 min	ramp to 130ºC, hold 30 minutes
Working Life	24.0 hour
Shelf Life	12.0 Month @Temperature -40.0 °C	Uncured, from date of manufacture

Descriptive Properties
Shear Strength	13 kg-f/die	Die, 3 x 3 mm, Si die on Glass @ 25 °C
	6 kg-f/die	Die, 3 x 3 mm, Si die on Glass @ 80 °C
Thixotropic Index	1.75	Uncured

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PLOCT5039 / 255250

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