Henkel Loctite® ECCOBOND FP4802 Epoxy

Login to see your most recently viewed materials here. Or if you don't have an account with us yet, then click here to register.

(Viewing data as-entered. Click here to return)

Henkel Loctite® ECCOBOND FP4802 Epoxy
Categories:	Polymer; Thermoset; Epoxy
Material Notes:	Appearance Black Cure Heat cure Application Encapsulating LOCTITE ECCOBOND FP4802 is a high purity, liquid encapsulant designed for use in applications utilizing lead-free solder. This product can withstand solder reflow temperatures up to 260°C after being exposed to JEDEC level 2 (85°C/60% RH, 168hours) preconditioning. It was formulated to meet “Green” non-halide objectives of many technical users and for temperature cycling ranges up to -65 to 150°C. LOCTITE ECCOBOND FP4802 features excellent flow properties allowing the material to penetrate fine pitch wires and deep cavities without entrapping voids. A cavity or potting dam is required for flow control. LOCTITE ECCOBOND FP4802 is suitable for bare chip protection of a variety of advanced packages, such as Ball Grid Arrays (BGA’s), Chip Scale Packages (CSP’s), Plastic Ball Grid Arrays (PBGA’s), and full arrays on Low Temperature cofired Ceramic (LTCC) Information provided by Loctite®
Vendors:	No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
Printer friendly version Download as PDF Download to Excel (requires Excel and Windows) Export data to your CAD/FEA program Add to Folder:

Physical Properties	Original Value	Comments

Specific Gravity	1.76 g/cc
Filler Content	72 %
Brookfield Viscosity	80000 cP	Spindle 7, speed 10 rpm

Mechanical Properties	Original Value	Comments
Flexural Strength	120 MPa	Cured; ASTM D790
Flexural Modulus	13000 MPa	Cured; ASTM D790

Thermal Properties	Original Value	Comments
CTE, linear	20.0 µm/m-°C @Temperature <=55.0 °C	Cured, alpha1
	100 µm/m-°C @Temperature 190 - 220 °C	Cured, alpha2
Maximum Service Temperature, Air	260 °C
Glass Transition Temp, Tg	50.0 °C	Cured

Processing Properties	Original Value	Comments
Cure Time	30.0 min @Temperature 125 °C	plus 90minutes @ 165°C, Alternative Cure Schedule
	60.0 min @Temperature 120 °C	plus 120minutes @ 165°C
Gel Time	20.0 min @Temperature 121 °C
Shelf Life	9.00 Month @Temperature -40.0 °C	from date of manufacture

Descriptive Properties
Extractable Ionic Content (ppm)	<5	Cured, Chloride (Cl-)
	<5	Cured, Sodium (Na+)
	<5	Cured, Potassium (K+)
Pot Life	8 hrs	time to double viscosity

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to go back to viewing the property data in MatWeb's normal format.

PLOCT5086 / 255297

	Advertise with MatWeb!
	Data sheets for over 180,000 metals, plastics, ceramics, and composites.
	HOME • SEARCH • TOOLS • SUPPLIERS • FOLDERS • ABOUT US • FAQ • LOG IN

System Message