Henkel Loctite® 3621 Epoxy

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Henkel Loctite® 3621 Epoxy
Categories:	Polymer; Thermoset; Epoxy
Material Notes:	Appearance (uncured): Red viscous gel LMS Components: One component - requires no mixing Cure: Heat cure Application: Surface mount adhesive Key Substrates: SMD components to PCB Other Application Areas: Small parts bonding Dispense Method: Syringe Dispense Speed: Very high 25,000 - 50,000 dots/h Wet Strength: High Information provided by Loctite®
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Physical Properties	Original Value	Comments

Specific Gravity	1.22 g/cc
Particle Size	<= 150 µm	Uncured
Viscosity	130 - 280 cP	Yield Point, Cone & Plate Rheometer: Haake PK 100, M10/PK 1 2° Cone
	500 - 3000 cP	Casson, Cone & Plate Rheometer: Haake PK 100, M10/PK 1 2° Cone

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PLOCT5110 / 255321

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