Appearance: Red Product Benefits: - Minimum bleed
- Good adhesion to a variety of substrates
- High hot/wet die shear strength
- 260ºC reflow capability for Pb-free applications
- Non-conductive
Cure: Heat cureApplication: Die attach Typical Package Application: PBGA, FlexBGA and Stacking BGA LOCTITE ABLESTIK 2025D die attach adhesive is designed for use in array Information provided by Loctite® |