Designer Molecules DMI-3006 Modified Polyimide based

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Designer Molecules DMI-3006 Modified Polyimide based
Categories:	Polymer; Adhesive
Material Notes:	Warpage on silicon is generated through thermo-mechanical interactions of various organic materials with silicon during assembly process. The magnitude of warpage is effected by:1)difference of the CTE between Si and resin.2)modulus of resin.3)processing & curing temperatures. Warpage increases as wafer diameter gets larger & wafer thickness gets thinner. DMI-3006is `The super low-stress resin’ for buffer layer and other organic layers. It shows much lower tensile modulus and much lower cure temperature than conventional resins(Table.1).DMI-3006provides the benefits of a polyimide resin film without warpage (Fig.1).Other benefits of the material include very low moisture absorption, excellent electrical performance and enhanced adhesion to metals, especially copper. DMI-3006 can be used with a general photo resist process(Fig.2). Information provided by Designers Molecules
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Physical Properties	Original Value	Comments

Water Absorption	0.10 % @Time 86400 sec	immersion
Moisture Absorption	0.100 % @Time 86400 sec	50% RH

Mechanical Properties	Original Value	Comments
Tensile Strength	1180 psi
Elongation at Break	62 %
Tensile Modulus	100 MPa

Electrical Properties	Original Value	Comments
Dielectric Constant	2.6 @Frequency 1.50e+10 Hz	IPC TM 650 2.5.5.9
Dissipation Factor	<= 0.0010 @Frequency 1.50e+10 Hz	IPC TM 650 2.5.5.9

Thermal Properties	Original Value	Comments
CTE, linear	164 µm/m-°C	a1
	222 µm/m-°C	a2
Glass Transition Temp, Tg	54.0 °C
Decomposition Temperature	446 °C	in air

Descriptive Properties
Weight Loss (%)	5	@ 358°C

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PDESGN012 / 255376

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