Henkel Loctite® ABLESTIK ABP 2030SCR Adhesive

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Henkel Loctite® ABLESTIK ABP 2030SCR Adhesive
Categories:	Polymer; Adhesive
Material Notes:	Appearance: Silver Product Benefits: Low stress Snap curable Cure: Heat cure Application: Die attach Filler Type: Silver Typical Package Application: Smart Card LOCTITE ABLESTIK ABP 2030SCR conductive die attach adhesive has been formulated for use in high throughput die attach applications. This material is designed to minimize stress and resulting warpage between dissimilar surfaces. It can be used in a variety of package sizes. Information provided by Loctite®
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Physical Properties	Original Value	Comments

Brookfield Viscosity	15000 cP	Uncured, CP51, Speed 5 rpm

Mechanical Properties	Original Value	Comments
Tensile Modulus	240.4 MPa @Temperature 150 °C	Cured, DMTA
	260.4 MPa @Temperature 250 °C	Cured, DMTA
	1514 MPa @Temperature 25.0 °C	Cured, DMTA
	3273 MPa @Temperature -65.0 °C	Cured, DMTA

Electrical Properties	Original Value	Comments
Volume Resistivity	0.00020 ohm-cm	Sample cured 120 secs @ 120ºC

Thermal Properties	Original Value	Comments
Thermal Conductivity	2.00 W/m-K

Processing Properties	Original Value	Comments
Cure Time	0.167 min @Temperature 150 °C	Alternate Cure Schedule
	2.00 min @Temperature 120 °C
Working Life	24.0 hour
Shelf Life	12.0 Month @Temperature -40.0 °C	Uncured, from date of manufacture

Descriptive Properties
Extractable Ionic Content (ppm)	<10	Cured, Chloride (Cl-)
	<10	Cured, Sodium (Na+)
	<10	Cured, Potassium (K+)
Shear Strength	1.28 kg-f	Die, 2 x 2 mm Si die on Ni/Sn/Cu, sample cured 120 seconds @ 120ºC, @ 150°C
	3.5 kg-f	Die, 2 x 2 mm die size, Si die on Au
	4.1 kg-f	Die, 2 x 2 mm Si die on Ni/Sn/Cu, sample cured 120 seconds @ 120ºC, @ 25°C
	4.6 kg-f	Die, 2 x 2 mm die size, Si die on Ni
	4.6 kg-f	Die, 2 x 2 mm die size, Si die on Ag
Thixotropic Index	5	Uncured, 0.5/5 rpm
Weight Loss (%)	0.4	Cured, 10 x 10 mm Si die on glass slide

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PLOCT5036 / 255247

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