Henkel Loctite® ABLESTIK 84-1LMI Polyimide

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Henkel Loctite® ABLESTIK 84-1LMI Polyimide
Categories:	Polymer; Thermoset; Polyimide, TS
Material Notes:	Appearance: Silver Product Benefits: Electrically conductive Low bleed Low outgassing Cure: Heat cure Application: Die attach Filler Type: Silver LOCTITE ABLESTIK 84-1LMI die attach adhesive is designed for microelectronic chip bonding applications. This adhesive is ideal for application by automatic dispenser or hand probe. Information provided by Loctite®
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Physical Properties	Original Value	Comments

pH	5.5
Brookfield Viscosity	30000 cP	Uncured, Speed 5 rpm

Mechanical Properties	Original Value	Comments
Shear Strength	12.0 MPa	Die, Al to Al

Electrical Properties	Original Value	Comments
Volume Resistivity	0.00050 ohm-cm	Cured

Thermal Properties	Original Value	Comments
CTE, linear	55.0 µm/m-°C	Cured, Below Tg
	150 µm/m-°C	Cured, Above Tg
Thermal Conductivity	2.40 W/m-K	Cured
Glass Transition Temp, Tg	103 °C	Cured, TMA

Processing Properties	Original Value	Comments
Cure Time	1.00 hour @Temperature 150 °C
	2.00 hour @Temperature 125 °C
Working Life	336 hour
Shelf Life	3.00 Month @Temperature 5.00 °C	Uncured, from date of manufacture
	6.00 Month @Temperature -10.0 °C	Uncured, from date of manufacture
	12.0 Month @Temperature -40.0 °C	Uncured, from date of manufacture

Descriptive Properties
Extractable Ionic Content (ppm)	<20	Cured, Chloride (Cl-)
	<20	Cured, Sodium (Na+)
	<20	Cured, Potassium (K+)
Shear Strength	19 kg-f/die	2 x 2 mm Si die on Ag/Cu LF
Thixotropic Index	4	Uncured, 0.5/5 rpm
Water Extract Conductivity	10 µmhos/cm	Cured
Weight Loss (%)	0.19	Cured @ 300ºC, TGA

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PLOCT5002 / 255213

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